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Wei-Ping Dow
5  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Novel Cu plating formula for filling through silicon vias:

, In: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference,
Shao-Ping Shen ; Wei-Ping Dow ; Motonobu Kubo... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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2

Electroplated Cu Bump with Ultra-Large Grain without Therma..:

, In: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D),
Dow, Wei-Ping ; Chan, Po-Fan - p. 36-36 , 2019
Link: https://doi.org/10.23919..
 
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3

List of Contributors:

, In: Comprehensive Hard Materials,
Achard, Jocelyn ; Aharonovich, Igor ; Anglada, Marc... - p. xv-xix , 2014
Link: https://doi.org/10.1016/..
 
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4

Structuring, Aggregating, and Evaluating Crowdsourced Desig..:

, In: Proceedings of the 18th ACM Conference on Computer Supported Cooperative Work & Social Computing,
Luther, Kurt ; Tolentino, Jari-Lee ; Wu, Wei... - p. 473-485 , 2015
Link: https://dl.acm.org/doi/1..
 
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5

CrowdCrit : crowdsourcing and aggregating visual design ..:

, In: Proceedings of the companion publication of the 17th ACM conference on Computer supported cooperative work & social computing,
Luther, Kurt ; Pavel, Amy ; Wu, Wei... - p. 21-24 , 2014
Link: https://dl.acm.org/doi/1..
 
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