Wen, David Wei
1926  Ergebnisse:
Personensuche X
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1

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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2

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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3

List of contributors:

, In: Electrochemical Membrane Technology for Water and Wastewater Treatment,
 
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4

A pn-Coupled Superjunction IGBT for High Switching Speed:

, In: 2019 IEEE 13th International Conference on ASIC (ASICON),
Liu, Lei ; Yao, Yao ; Wen, Meng-Qi.. - p. 1-4 , 2019
 
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5

The Visual Object Tracking VOT2017 Challenge Results:

, In: 2017 IEEE International Conference on Computer Vision Workshops (ICCVW),
Kristan, Matej ; Leonardis, Ales ; Matas, Jiri... - p. 1949-1972 , 2017
 
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6

List of contributors:

, In: Machine Learning Aided Analysis, Design, and Additive Manufacturing of Functionally Graded Porous Composite Structures,
Bassir, David ; Boutahar, Lhoucine ; Boutahar, Youssef... - p. xv-xviii , 2024
 
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7

Contributors:

, In: Chromatin Readers in Health and Disease,
Behrouzi, Reza ; Binda, Olivier ; Chen, Xiao... - p. xiii-xv , 2024
 
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8

List of Contributors:

, In: Molecular, Genetic, and Nutritional Aspects of Major and Trace Minerals,
 
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9

Traumatic Braquial Plexus Injuries:

, In: Orthopaedics and Trauma,
Chien, Hsin-I ; Lin, Mo-Han ; Chen, Lisa Wen-Yu... - p. 361-375 , 2024
 
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11

Contributors:

, In: Braddom's Physical Medicine and Rehabilitation,
 
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12

Mathematical Foundations of a Geometric Theory of Diffracti..:

, In: 2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring),
Wei, David H. ; Howell, Rafael ; Lu, Yen-Wen. - p. 2867-2879 , 2019
 
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13

List of Contributors:

, In: Genetics of Bone Biology and Skeletal Disease,
 
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14

A Low Profile Printed Quadrifilar Helical Antenna for Handh..:

, In: Proceedings of the International Conference on Imaging, Signal Processing and Communication,
Wang, Wei-Hsu ; Chiu, Chien-Wen ; Ni, David C.. - p. 126-130 , 2017
 
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