Woo, Hyun-Joo
164  Ergebnisse:
Personensuche X
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1

Air Arc Simulation In Low Voltage Electrodes:

, In: 2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST),
Kim, Keewon ; Lee, Jeong Su ; Woo Joo, Hyun... - p. 233-236 , 2022
 
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2

Indications for Vocal Fold Injection:

, In: Vocal Fold Injection,
Woo, Joo Hyun - p. 23-28 , 2021
 
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3

Calculation of the Switch Arc in Low Voltage Circuit Breake..:

, In: 2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST),
Sun, Hao ; Joo, Hyun-Woo ; Wu, Yi... - p. 235-238 , 2019
 
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4

3D Simulation of Air Arc in the Molded Case Circuit Breaker:

, In: 2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST),
Kim, Keewon ; Joo, Hyun Woo ; Yoon Bae, Chae.. - p. 239-242 , 2019
 
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5

Back-Illuminated SPAD in 40 nm CIS Technology Achieving 56 ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Park, Eunsung ; Eom, Doyoon ; Kim, Joo-Hyun... - p. 1-4 , 2023
 
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6

Development of a Smart Guidewire for Intravascular Sensing:

, In: IFMBE Proceedings; 9th International Conference on the Development of Biomedical Engineering in Vietnam,
Dong, Chao-Wei ; Joo, Dong-Hyun ; Moon, Ki-Jeong... - p. 22-32 , 2023
 
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7

Development of Thermoplastic Materials for the Application ..:

, In: 2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST),
 
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8

Breakthrough of selector technology for cross-point 25-nm R..:

, In: 2017 IEEE International Electron Devices Meeting (IEDM),
Kim, Soo Gil ; Hwang, Hyun Mi ; Lee, Bo Mi... - p. 2.1.1-2.1.4 , 2017
 
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9

An 80nm 4Gb/s/pin 32b 512Mb GDDR4 Graphics DRAM with Low-Po..:

, In: 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers,
Ihm, Jeong-Don ; Bang, Sam-Young ; Lee, Mi-Jin... - p. None , 2007
 
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10

LightTrader : World's first AI-enabled High-Frequency Tradi..:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Kim, Hyunsung ; Yoo, Sungyeob ; Bae, Jaewan... - p. 1-10 , 2022
 
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11

Implementation of new services to support ubiquitous comput..:

, In: Third IEEE Workshop on Software Technologies for Future Embedded and Ubiquitous Systems (SEUS'05),
Tack-Don Han ; Srini, V.P. ; Joo-Hyeon Lee... - p. 45,46,47,48,49 , 2005
 
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12

First-principles study of the conduction mechanism in tanta..:

, In: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Lee, Juho ; Kim, Seunghyun ; Kim, Hyoseok... - p. 197-200 , 2023
 
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13

A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exp..:

, In: 2022 IEEE International Solid-State Circuits Conference (ISSCC),
Kim, Dae-Hyun ; Song, Byungkyu ; Ahn, Hyun-a... - p. 448-450 , 2022
 
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14

Low Voltage and High Speed 1Xnm 1T1C FE-RAM with Ultra-Thin..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Sung, Minchul ; Rho, Kwangmyoung ; Kim, Jayong... - p. 33.3.1-33.3.4 , 2021
 
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15

Planar-Radial Structured Thermoelectric Cooler for Local Ho..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Kim, Cheol ; Jeong, Min-Woo ; Kim, Sungtae... - p. 2242-2246 , 2020
 
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