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Wu, Yi‐Long
53  Ergebnisse:
Buchkapitel (Online) X
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1

Integrated Data Acquisition Module based on CPO packaging:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lv, Xiaomeng ; Xibin, Li ; Shaoyong, Chen... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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2

Identity Recall: Sharing Energy Farm as a Means of Reconstr..:

, In: Sustainable Development Goals Series; Design for Resilient Communities,
Liu, Yuqiu ; Wu, Yilong - p. 481-491 , 2023
Link: https://doi.org/10.1007/..
 
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3

A Process Design Method for Multichip Module using Model Ba..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Li, Yang ; Wu, Yilong ; Chen, Chunmei... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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4

Study on fiber tail pipe packaging technology of microwave-..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Jiaming ; Wu, Yilong ; Lv, Xiaomeng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Photoelectric Characteristics of An 18 GHz Electronic-opto ..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Lv, Xiaomeng ; Wu, Yilong ; Liao, Ao... - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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6

Hybrid integrated packaging of a typical microwave-to-optic..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
WU, Yilong ; LV, Xiaomeng ; LI, Yaru... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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7

Simulation and Fatigue Damage Prediction for Board Level CB..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Yangyang ; Dong, Dong ; Wang, Hui... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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8

Research on failures of a microwave transmission line strid..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Yilong ; Zeng, Yuanqi ; Lu, Yinquan. - p. 1169-1172 , 2017
Link: https://doi.org/10.1109/..
 
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9

Hybrid integrated packaging of an optical-to-microwave conv..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Yilong, Wu ; Xiaomeng, Lyu ; Yaru, Li... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

Study on the degradation of wire bonding wedges and a propo..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Yilong, WU ; Zehai, WEN ; Pingsheng, ZHANG... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

A 3.75Mb Embedded RRAM IP on 40nm High-Voltage CMOS Technol..:

, In: 2024 IEEE International Memory Workshop (IMW),
He, Yuan ; Ma, Chengxiang ; Ma, Xiangchao... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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12

An Orthographic Mean-Shift Clustering and Segmentation Meth..:

, In: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium,
Xiao, Changlin ; Wu, Zhiling ; Ma, Guangdi... - p. 6608-6611 , 2023
Link: https://doi.org/10.1109/..
 
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13

An Indirect Verification Approach for Dynamic Control of Wh..:

, In: 2023 5th International Conference on Electrical Engineering and Control Technologies (CEECT),
Wu, Shuang ; Liu, Wanquan ; Tan, Yilong. - p. 438-446 , 2023
Link: https://doi.org/10.1109/..
 
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14

Retinex Meets Transformer: Bridging Illumination and Reflec..:

, In: Communications in Computer and Information Science; Neural Information Processing,
Cheng, Yilong ; Wu, Zhijian ; Li, Jun. - p. 388-402 , 2023
Link: https://doi.org/10.1007/..
 
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15

Clip Fusion with Bi-level Optimization for Human Mesh Recon..:

, In: Proceedings of the 31st ACM International Conference on Multimedia,
Wu, Peng ; Lu, Xiankai ; Shen, Jianbing. - p. 105-115 , 2023
Link: https://dl.acm.org/doi/1..
 
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