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X
Xianshan Dong
3  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Investigation of bias stress degradation of Depletion-Mode ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Guo, Chenrun ; Zhou, Bin ; Lai, Canxiong... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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2

Long-term Reliability Evaluation of Internal Atmosphere on ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Huang, Xinlong ; Dong, Xianshan ; Zhou, Bin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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3

Temperature Hysteresis Effect of Q-factor in Vacuum Package..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Dong, Xianshan ; Huang, Qinwen ; Lai, Ping... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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