Xing Meng-dao
33  Ergebnisse:
Personensuche X
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1

Motion compensation technique for high resolution spotlight..:

, In: 2007 1st Asian and Pacific Conference on Synthetic Aperture Radar,
Tang, Yu ; Xing, Meng-dao - p. None , 2007
 
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2

High sensitivity biosensor for Staphylococcus Aureus detect..:

, In: 2019 18th International Conference on Optical Communications and Networks (ICOCN),
Chen, Ling ; Liu, Bin ; Liao, Yun-Cheng... - p. 1-3 , 2019
 
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3

Ultrasensitive Microfiber Refractive Index Sensor Based on ..:

, In: 2019 18th International Conference on Optical Communications and Networks (ICOCN),
Liao, Yun-Cheng ; Mao, Zhi-Qiang ; Liu, Bin... - p. 1-3 , 2019
 
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4

Develop an Intelligent Robotic Arm Grasp and Control System..:

, In: 2022 IEEE 4th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Hu, Nian-Ze ; Lin, Qi-Ren ; Wu, Ruo-Wei... - p. 582-584 , 2022
 
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5

Preliminary Design and Motion Response Analysis of VLFS:

, In: Proceedings of the 7th International Conference on Architecture, Materials and Construction; Lecture Notes in Civil Engineering,
Luo, Zhao ; Wu, Qi-He ; Feng, Xian-Dao. - p. 3-8 , 2022
 
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6

Astronomical Forcing of Favorable Sections of Lacustrine Ti..:

, In: Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering,
Tang, Wen-qiang ; Zhang, Dao-wei ; Chen, Xiao-dong... - p. 659-673 , 2022
 
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7

Tensor Robust PCA Based on Transformed Tensor Singular Valu..:

, In: 2022 IEEE International Conference on Bioinformatics and Biomedicine (BIBM),
Zhang, Sheng-Nan ; Zhang, Yu-Lin ; Liu, Jin-Xing... - p. 2162-2168 , 2022
 
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8

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Gui, Jun ; Li, Xing-Min ; Li, Wang-Yun... - p. 1-4 , 2020
 
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9

Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Li, Xing-Min ; Gui, Jun ; Li, Wang-Yun... - p. 1-4 , 2020
 
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10

A Circle Pattern Algorithm via Combinatorial Ricci Flows:

, In: Trends in Mathematics; Analysis as a Life,
Xi, Dong-Meng ; Lan, Shi-Yi ; Dai, Dao-Qing - p. 117-138 , 2019
 
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11

Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induce..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Wu, Ji-Yen ; Chen, Ting-Wen ; Chiu, Tz-Cheng... - p. 76-79 , 2019
 
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12

The study on elastic properties of Cu3Sn under pressure via..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Niu, Fan-Fan ; Luan, Xing-He ; Feng, Chuang... - p. 1207-1211 , 2017
 
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13

The electronic properties of zinc-blende GaN, wurtzite GaN ..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Luan, Xing-He ; Feng, Chuang ; Qin, Hong-Bo.. - p. 1483-1487 , 2017
 
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14

The analysis and modeling of on-resistance in high-voltage ..:

, In: 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings,
Ke, Dao-Ming ; Chen, Jun-Ning ; Shan-Gao. - p. None , 2006
 
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15

A Physics-informed Neural Network Method for LC Parameter E..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Kong, Jie ; Zhou, Dao ; Wei, Xing. - p. 3957-3962 , 2024
 
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