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X
Yang, Dao-guo
68  Ergebnisse:
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1

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Gui, Jun ; Li, Xing-Min ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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2

Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Li, Xing-Min ; Gui, Jun ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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3

The influence of phase inhomogeneity on the current density..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Wen, Quan-Zhang ; Guo, Lei ; Qin, Hong-Bo.. - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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4

Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Wang-Yun ; Peng, Guan-Qiang ; Cheng, Tian-Xiang... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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5

Anisotropic mechanical characteristics of Cu6Sn5 micro-cant..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Kuang, Tian-Feng ; Qin, Hong-Bo ; Li, Wang-Yun. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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6

The study on elastic properties of Cu3Sn under pressure via..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Niu, Fan-Fan ; Luan, Xing-He ; Feng, Chuang... - p. 1207-1211 , 2017
Link: https://doi.org/10.1109/..
 
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7

The electronic properties of zinc-blende GaN, wurtzite GaN ..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Luan, Xing-He ; Feng, Chuang ; Qin, Hong-Bo.. - p. 1483-1487 , 2017
Link: https://doi.org/10.1109/..
 
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8

Optimization of the fatigue life of Epoxy Molding Compounds..:

, In: 2008 International Conference on Electronic Packaging Technology & High Density Packaging,
Cai, Miao ; Yang, Dao-guo ; Li, Quan-yong. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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9

Impact of Hot Carrier Stress on RF Power Characteristics of..:

, In: IEEE MTT-S International Microwave Symposium Digest, 2005.,
Huang, Sheng-Yi ; Chen, Kun-Ming ; Huang, Guo-Wei... - p. 161-164 , 2005
Link: https://doi.org/10.1109/..
 
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10

Improvement of Transient Interfacial Tension and Displaceme..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019,
Shi, Yu ; Liu, Li ; Ding, Ya-nan. - p. 917-934 , 2020
Link: https://doi.org/10.1007/..
 
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11

Research Methods and Techniques for Acute Exacerbation of C..:

, In: Acute Exacerbation of Chronic Hepatitis B,
Chen, Zhi ; Xi, Dong ; Chen, Tao.. - p. 49-118 , 2019
Link: https://doi.org/10.1007/..
 
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12

Prognosis, Prevention and Research Prospects of Progression..:

, In: Acute Exacerbation of Chronic Hepatitis B,
Wang, Yu-Ming ; Yang, Dao-Feng ; Wang, Ming... - p. 457-497 , 2019
Link: https://doi.org/10.1007/..
 
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13

Adaptive Vehicle Detection and Classification Scheme for Ur..:

, In: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW),
Yang, Dao-Wei ; Wang, Hsin-Tzu ; Chen, Yu-Jung. - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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14

A Modified TOPSIS Method utilizing the Gray Correlation Ana..:

, In: 2010 International Conference on Information Society,
Yang, Guan-Dao ; Sun, Lu ; Liu, Xiao - p. 510-513 , 2010
Link: https://doi.org/10.1109/..
 
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15

Chaos anti-control and discrete map model for voltage-progr..:

, In: 2009 2nd IEEE International Conference on Computer Science and Information Technology,
Zhang, Xiaofei ; Zhang, Dao-Yang - p. None , 2009
Link: https://doi.org/10.1109/..
 
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