Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Yang, Mei-Na
980  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

Joint Uplink and Downlink Optimization for Wireless Powered..:

, In: Wireless and Satellite Systems; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering,
Zhang, Mengshu ; Na, Zhenyu ; Yang, Mei.. - p. 738-746 , 2019
Link: https://doi.org/10.1007/..
 
?
2

A Roadmap of Information and Communication Technology-Orien..:

, In: 2021 9th International Conference on Information and Education Technology (ICIET),
An, Si Yang ; Cheung, Chi Fai ; Cheng, Mei Na. - p. 423-430 , 2021
Link: https://doi.org/10.1109/..
 
?
3

The Influence of Pin Position on CDM Peak Current of Chips ..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
He, Liyi ; Wang, Menghua ; Zheng, Hui... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
?
4

Study on Failure Mechanism of C4 Bump Solder Excursion in C..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wei, Xixiong ; Lin, Xinyi ; Zhou, Shilu.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
?
5

Study on ELK Dielectric Reliability During the Solder Reflo..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Zheng, Jialin ; Zhao, Yunong ; Wang, Zhuqiu... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
?
6

Investigation on the Root Cause of ESD Failure of Large Siz..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Zhang, Yunhe ; Lin, Shaobing ; Chao, Shuanshe... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
?
7

Research on the Functional Failure of Large Scale Chips Cau..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Chao, Shuanshe ; Lin, Xinyi ; Wei, Xixiong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
?
8

Reliability Research on micro bump and c4bump in Large-Size..:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Li, Xiang ; Wang, Zhuqiu ; He, Xiao.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
9

Organic Thermal Interface Materials Delamination Analysis o..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wu, Zhuolun ; Wei, Xixiong ; Wang, Zhuqiu... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
?
10

A New Numerical Algorithm to Estimate the Average Travel Ti..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Sun, Niuyi ; Yang, Dan ; Mei, Na - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
?
11

A New High-efficient Burn-in Screening Methodology Applied ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Sheng, Yalan ; Gao, Yining ; Sun, Niuyi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
12

Failure Analysis for IIH leakage on 7nm FinFFT Technology C..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chao, Shuanshe ; Lin, Xinyi ; Dong, Chen... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
13

Reliability analysis of metal thermal interface materials f..:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Ouyang, Keqing ; Wu, Zhuolun ; Wang, Zhuqiu... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
14

Correlation Analysis between Warpage and Metal Thermal Inte..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Zhuolun ; Wang, Zhuqiu ; Qi, Di... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
15

Influence of pin position on the CDM peak current based on ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Menghua ; Li, Huafeng ; Yang, Dan... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
1-15