Personensuche
X
?
Wireless and Satellite Systems; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering ,
1
Joint Uplink and Downlink Optimization for Wireless Powered..:
, In:
?
2021 9th International Conference on Information and Education Technology (ICIET) ,
2
A Roadmap of Information and Communication Technology-Orien..:
, In:
?
2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
3
The Influence of Pin Position on CDM Peak Current of Chips ..:
, In:
?
2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
4
Study on Failure Mechanism of C4 Bump Solder Excursion in C..:
, In:
?
2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
5
Study on ELK Dielectric Reliability During the Solder Reflo..:
, In:
?
2024 Conference of Science and Technology for Integrated Circuits (CSTIC) ,
6
Investigation on the Root Cause of ESD Failure of Large Siz..:
, In:
?
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
7
Research on the Functional Failure of Large Scale Chips Cau..:
, In:
?
2023 China Semiconductor Technology International Conference (CSTIC) ,
8
Reliability Research on micro bump and c4bump in Large-Size..:
, In:
?
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
9
Organic Thermal Interface Materials Delamination Analysis o..:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
10
A New Numerical Algorithm to Estimate the Average Travel Ti..:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
11
A New High-efficient Burn-in Screening Methodology Applied ..:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
12
Failure Analysis for IIH leakage on 7nm FinFFT Technology C..:
, In:
?
2023 China Semiconductor Technology International Conference (CSTIC) ,
13
Reliability analysis of metal thermal interface materials f..:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
14
Correlation Analysis between Warpage and Metal Thermal Inte..:
, In:
?
2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
15