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Yang, Ming-Ta
171  Ergebnisse:
Buchkapitel (Online) X
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1

Apply K-means Cluster Analysis to Perform Adaptive Protecti..:

, In: 2024 IEEE/IAS 60th Industrial and Commercial Power Systems Technical Conference (I&CPS),
Gu, Jyh-Cherng ; Yen, Yu ; Yang, Hao. - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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2

Emerging Memory RRAM Embedded in 12FFC FinFET Technology fo..:

, In: 2023 International Electron Devices Meeting (IEDM),
Wu, Chun-Yu ; Yang, Chang-Feng ; Lai, Chih-Wei... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Automatic Frequency Control Ancillary Service and Virtual I..:

, In: 2023 IEEE Industry Applications Society Annual Meeting (IAS),
Gu, Jyh-Cherng ; Lin, Jing-Lun ; Yang, Ming-Ta - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Dynamic Load-Shedding Technology based on IEC 61850 in Mi..:

, In: 2022 IEEE Industry Applications Society Annual Meeting (IAS),
Gu, Jyh-Cherng ; Hsu, Lin-Chen ; Wang, Jing-Min. - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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5

Demonstration of High Endurance Capability on Mega-Bit RRAM..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Yang, Chang-Feng ; Wu, Chun-Yu ; Shih, Meng-Chun... - p. 318-319 , 2022
Link: https://doi.org/10.1109/..
 
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6

High Impedance Fault Detection in Overhead Distribution Fee..:

, In: 2020 IEEE/IAS 56th Industrial and Commercial Power Systems Technical Conference (I&CPS),
Gu, Jyh-Cherng ; Hsu, Lin-Chen ; Wang, Jing-Min. - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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7

Silicon Process Impact on 5G NR mmWave Front End Design and..:

, In: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),
Cheng, Chuan-Cheng ; Dunworth, Jeremy ; Kalpat, Sriram... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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8

Research on Integrating Wind Turbine into Intelligent IEC 6..:

, In: 2019 2nd Asia Conference on Energy and Environment Engineering (ACEEE),
Gu, Jyh-Cherng ; Liu, Chun-Hung ; Yang, Ming-Ta. - p. 54-58 , 2019
Link: https://doi.org/10.1109/..
 
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9

Fast-handoff schemes for inter-subnet handoffin IEEE 802.11..:

, In: Proceedings of the 2007 international conference on Wireless communications and mobile computing,
Wu, Cheng-Shong ; Yang, Ming-Ta ; Hwang, Kao-Shing - p. 146-151 , 2007
Link: https://dl.acm.org/doi/1..
 
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10

Industrially Applicable Read Disturb Model and Performance ..:

, In: 2020 IEEE Symposium on VLSI Technology,
Yang, Chang-Feng ; Wu, Chun-Yu ; Yang, Ming-Han... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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11

A novel intelligent protection scheme for high impedance fa..:

, In: 2004 IEEE Region 10 Conference TENCON 2004.,
Ming-Ta Yang ; Jhy-Cherng Gu ; Wen-Shing Hsu.. - p. 401,402,403,404 , 2004
Link: https://doi.org/10.1109/..
 
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12

List of Contributors:

, In: Handbook of Student Engagement Interventions,
Amemiya, Jamie ; Appleton, James J. ; Archambault, Isabelle... - p. ix-x , 2019
Link: https://doi.org/10.1016/..
 
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13

A 40nm 24.6TOPS/W Scalable EfficientDet Processor for Objec..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chuang, Yu-Chuan ; Lin, Ming-Guang ; Huang, Chi-Tse... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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14

Characterization of Low Loss Dielectric Materials for High-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Tzu Nien ; Lau, John H ; Ko, Cheng-Ta... - p. 2222-2229 , 2022
Link: https://doi.org/10.1109/..
 
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15

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
Link: https://doi.org/10.1109/..
 
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