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Yang, Zhen-Lin
1648  Ergebnisse:
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1

11.4 A Double Step-Down Dual-Output Converter with Cross Re..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Hung, Wei-Chieh ; Chen, Cheng-Wen ; Huang, Yu-Wei... - p. 188-190 , 2023
Link: https://doi.org/10.1109/..
 
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2

Research on Board Level Reliability of Mounted Ceramic Pack..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Qian ; Chen, Jiang-Tao ; Yang, Zhen-Tao. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Simulation and Analysis of Temperature Cycle Failure at MLC..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Yao-Yao ; Yang, Zhen-Tao ; Liu, Lin-Jie - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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4

30.2 A 93.2%-Efficiency Multi-Input Bipolar Energy Harveste..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Yang, Zhen-Yu ; Chen, An ; Chen, Cheng-Wen... - p. 440-442 , 2023
Link: https://doi.org/10.1109/..
 
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5

Study on combining technology of thin film process and mult..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yu, Fei ; Yang, Zhen-tao ; Yu, Xi-meng. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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6

Research on the influence of parallel seam welding paramete..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Zhen-tao ; Chen, Jiang-tao ; Liu, Lin-jie. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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7

Research on the influence of electroplating lines on the tr..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Zhen-Tao ; Yi, Fei ; Liu, Lin-Jie. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Research on ceramic package for high temperature electronic..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Zhen-tao ; Yu, Xi-meng ; Liu, Lin-jie. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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9

Research on resonance reduction method of CQFN ceramic pack..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yu, Xi-Meng ; Yang, Zhen-Tao ; Liu, Lin-Jie - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

Research on Signal Integrity of UWB BGA Differential Transm..:

, In: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
Yu, Xi-meng ; Yang, Zhen-tao ; Liu, Lin-jie - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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11

Research on design and fabrication of ceramic package for m..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Qian ; Liu, Yao-Yao ; Yang, Zhen-Tao. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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12

Research on design and processing technology of 0.4mm pitch..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Zhen-tao ; Yu, Fei ; Liu, Lin-jie.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Research of design and processing technology of CQFP packag..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Yang, Zhen-tao ; yu, Fei ; Peng, Bo.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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14

Research on the board level reliability of CQFP package wit..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
yu, Fei ; Yang, Zhen-tao ; Peng, Bo.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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15

LncRNA-Disease Association Prediction Based on Graph Neural..:

, In: Intelligent Computing Theories and Application; Lecture Notes in Computer Science,
Yuan, Lin ; Zhao, Jing ; Sun, Tao... - p. 262-269 , 2020
Link: https://doi.org/10.1007/..
 
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