Yeo, Pei Ming
22  Ergebnisse:
Personensuche X
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1

Development of A Wearable Self-Powered Sensor Using Triboel..:

, In: 2024 International Conference on Green Energy, Computing and Sustainable Technology (GECOST),
Siau, Lei-Jun ; Yeo, Joey Joo-Sii ; Chee, Pei-Song.. - p. 463-466 , 2024
 
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2

Preliminary Exploratory Study: Are HEPs Ready for Communica..:

, In: 2023 International Conference on Digital Applications, Transformation & Economy (ICDATE),
Keoy, Kay Hooi ; Iqbal, Javid ; Ho, Meng Chuan... - p. 1-5 , 2023
 
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3

How Social Influence and Hedonic/Utilitarian Outcome Expect..:

, In: 2022 International Conference on Digital Transformation and Intelligence (ICDI),
Liew, Tze Wei ; Gan, Chin Lay ; Tan, Su-Mae.. - p. 161-167 , 2022
 
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4

Fire Resistance and Mechanical Properties of the Fire-Resis..:

, In: Lecture Notes in Mechanical Engineering; Advances in Material Science and Engineering,
 
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5

An Inductorless 5-GHz Differential Dual Regulated Cross-Cas..:

, In: 2019 IEEE 13th International Conference on ASIC (ASICON),
 
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7

Gate-all-around Twin Silicon nanowire SONOS Memory:

, In: 2007 IEEE Symposium on VLSI Technology,
Suk, Sung Dae ; Yeo, Kyoung Hwan ; Cho, Keun Hwi... - p. None , 2007
 
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9

TiN/HfSiOx Gate Stack Multi-Channel Field Effect Transistor..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Kim, Sung Min ; Yoon, Eun Jung ; Kim, Min Sang... - p. 72-73 , 2006
 
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10

Contributors:

, In: Circularity of Plastics,
 
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12

The Effects of Voids on Solder Joint Reliability in First L..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lim, Sze Pei ; Lee, Kor Oon ; Oi, Kiyoshi... - p. 1-4 , 2022
 
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13

Influence of micro voids in flip chip bump on electro-migra..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Murayama, Kei ; Oon Lee, Kor ; Ono, Toshiaki... - p. 1144-1152 , 2022
 
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14

Investigating Synchronized Optical Ballistocardiography vs ..:

, In: 2022 IEEE International Conference on Signal Processing and Communications (SPCOM),
 
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15

Voids in First-Level Interconnects and Their Impact on Sold..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Kor Oon ; Oi, Kiyoshi ; Lim, Sze Pei... - p. 5-6 , 2022
 
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