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2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. ,
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Highly Scalable Saddle-Fin (S-Fin) Transistor for Sub-50nm ..:
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2020 20th International Conference on Control, Automation and Systems (ICCAS) ,
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Finite State Machine based Vehicle System for Autonomous Dr..:
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2022 IEEE International Solid-State Circuits Conference (ISSCC) ,
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A 16Gb 9.5Gb/S/pin LPDDR5X SDRAM With Low-Power Schemes Exp..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
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13.1 A 1Tb 4b/cell NAND Flash Memory with tPROG=2ms, tR=110..:
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The Minerals, Metals & Materials Series; REWAS 2022: Developing Tomorrow's Technical Cycles (Volume I) ,
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KIGAM Technology for the Recovery of NdFeB Waste Magnet and..:
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The Minerals, Metals & Materials Series; REWAS 2022: Developing Tomorrow's Technical Cycles (Volume I) ,
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A Green Process to Acquire a High Purity Rare Earth Element..:
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The Minerals, Metals & Materials Series; Rare Metal Technology 2020 ,
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Recovery of Rare Earth Elements from Waste Permanent Magnet..:
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2015 11th Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR) ,
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Optical parametric chirped pulse amplifier for a 4 PW laser..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Reliability of Indium Solder Joints using a Laser-Assisted ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding with Compression (LABC) based Tiling..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Anisotropic Solder Paste (ASP) Material Solution for Laser ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Micro-structure analysis of solder joint using room tempera..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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