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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Fine Pitch Micro Via Interconnection with Reliable Electrol..:
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2019 8th International Conference On Software Process Improvement (CIMPS) ,
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Microstructural analysis in foods of vegetal origin: an app..:
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Proceedings of the 2017 ACM International Conference on Management of Data ,
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