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Young Min Jeon
216  Ergebnisse:
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1

All-optical flip-flop based on optical bistability in an in..:

, In: Optical Fiber Communication Conference and Exhibit,
Young-Il Kim ; Jae Hun Kim ; Young Min Jeon... - p. 30,31 , 2002
Link: https://doi.org/10.1109/..
 
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2

Developing a Mobile Application Linking the Microsystems of..:

, In: HCI International 2024 Posters; Communications in Computer and Information Science,
Jeon, Young Eun ; Park, Hye Jun ; Suh, Hye Min.. - p. 49-56 , 2024
Link: https://doi.org/10.1007/..
 
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3

A 12b 50 MHz 3.3 V CMOS acquisition time minimized A/D conv..:

, In: Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106),
Young-Deuk Jeon ; Byeong-Lyeol Jeon ; Seung-Chul Lee.. - p. 613,614,615,616 , 2000
Link: https://doi.org/10.1109/..
 
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4

Implementation of IoT-Based Control System for Maintenance ..:

, In: 2024 26th International Conference on Advanced Communications Technology (ICACT),
Park, Hoon-Min ; Jung, Hyun-Min ; Lee, Dae-Hee... - p. 01-05 , 2024
Link: https://doi.org/10.23919..
 
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5

Implementation of 100CMM Thermal Storage Combustion Oxidize..:

, In: 2022 22nd International Conference on Control, Automation and Systems (ICCAS),
Yoon, Dal-Hwan ; Han, Beom-Soon ; Lim, Tae-Yeung... - p. 1814-1818 , 2022
Link: https://doi.org/10.23919..
 
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6

Fabrication of silicon optical scanner for laser display:

, In: 2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399),
Jin-Ho Lee ; Young-Chul Ko ; Do-Hyun Kong... - p. 13,14 , 2000
Link: https://doi.org/10.1109/..
 
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7

A Method of Extending the Transmission and Reception Range ..:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
Kim, Ga-Young ; Eom, Su-Hong ; Lee, Eung-Hyuk. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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8

DQ and DQS Receiver for HBM3 Memory Interface with DFE Offs..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Park, Sujin ; Jeon, Young-Deuk ; Kim, Yi-Gyeong... - p. 215-216 , 2023
Link: https://doi.org/10.1109/..
 
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9

2.5D Large-Scale Interposer Bonding Process Verification us..:

, In: 2023 International Conference on Electronics, Information, and Communication (ICEIC),
Park, Sujin ; Kim, Yi-Gyeong ; Jeon, Young-Deuk... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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10

High reliability performance of Ag-cored Au coated wire cap..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jeon, Sung-Min ; Kim, Sang-Yeob ; Lee, Sung-Young... - p. 503-508 , 2022
Link: https://doi.org/10.1109/..
 
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11

A 12b 50 MHz 3.3V CMOS acquisition time minimized A/D conve..:

, In: Proceedings of the 2000 Asia and South Pacific Design Automation Conference,
Jeon, Young-Deuk ; Jean, Byeong-Lyeol ; Lee, Seung-Chul.. - p. 613-616 , 2000
Link: https://dl.acm.org/doi/1..
 
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12

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Jung, Wontaeck ; Kim, Hyunggon ; Kim, Do-Bin... - p. 236-237 , 2024
Link: https://doi.org/10.1109/..
 
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13

Implementation and Performance Analysis of Time-Determined ..:

, In: 2022 16th International Conference on Ubiquitous Information Management and Communication (IMCOM),
Do, Young Soo ; Ho Kim, Min ; Jeon, Jae Wook - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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14

Contributors:

, In: Graphene for Flexible Lighting and Displays,
Cho, Hyunsu ; Cho, Nam Sung ; Choi, Yong Seok... - p. vii-viii , 2020
Link: https://doi.org/10.1016/..
 
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15

List of Contributors:

, In: Bladder Cancer,
Burton, Jeremy P. ; Chanyi, Ryan M. ; Cho, Jeong Y.... - p. xxi-xxiii , 2018
Link: https://doi.org/10.1016/..
 
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