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X
Yu, Shuhui
61  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Glycine-Modified Boron Nitride/Epoxy Composites with High T..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Dou, Zhen'An ; Yu, Junyi ; Li, Peng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Enhanced reliability of ultra-thin BME-MLCCs based on low o..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Huang, Xiong ; Zhang, Lei ; Yu, Shuhui... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Enhanced Thermal Conductivity of Epoxy Adhesive Films by Fi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xu, Yuping ; Xu, PengPeng ; Li, Peng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

Dielectric properties and reliability of calcium-doped BaTi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lv, Yetong ; Zhang, Lei ; Wang, Pengfei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Effect of Zr4+ doping on electrical property of BaTiO3-base..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Chun ; Huang, Xiong ; Zhang, Lei... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Contribution of sintering process to the reliability of X7R..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jian, Gang ; Zhang, Lei ; Yu, Shuhui... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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7

A Study on Transmission Loss of Build-up Film Applied to IC..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Kong, Weikun ; Chen, Wenbo ; Zhong, Cheng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

A Comprehensive Study on Signal Integrity of Build-up Film ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhong, Cheng ; Chen, Wenbo ; Kong, Weikun... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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9

Improved Dielectric Constant and Breakdown Strength of Poly..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
TingLi, TingLi ; Liu, Jie ; Tang, Shenghua... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

An investigation on the on dielectric, ferroelectric proper..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Pengfei ; Zhang, Lei ; Yu, Shuhui... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

The effect of tetragonality on direct current (dc) bias cha..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Yuyang ; Zhang, Lei ; Huang, Xiong... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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12

The dependence of reliability on raw material in BME-MLCCs:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Luan, Saiwei ; Li, Kun ; Zhang, Lei... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Preparation of high-quality Y:Hf0.5Zr0.5O2 ferroelectric ga..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Cai, Yali ; Yu, Liang ; Yue, Wenfeng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

SrTiO3-Bi3.25La0.75Ti3O12 energy storage film capacitors fa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yue, Wenfeng ; Yu, Liang ; Liu, Lixia... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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15

Enhanced thermomechanical and dielectric properties of the ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Zheng ; Luo, Suibin ; Chu, Baojin. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
1-15