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Yuan, Shih-Hsiang
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1

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
Link: https://doi.org/10.1109/..
 
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2

A High Efficiency Hardware Accelerator for Convolution Neur..:

, In: 2023 9th International Conference on Applied System Innovation (ICASI),
Liang, Chiao-Yu ; Chang, Yang-Rwei ; Yang, Po-Hsiang. - p. 157-159 , 2023
Link: https://doi.org/10.1109/..
 
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3

WiRiS: Transformer for RIS-Assisted Device-Free Sensing for..:

, In: 2023 IEEE 34th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC),
Chung, Wei-Yu ; Shen, Li-Hsiang ; Feng, Kai-Ten... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

A 22nm 4Mb STT-MRAM Data-Encrypted Near-Memory Computation ..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Chiu, Yen-Cheng ; Yang, Chia-Sheng ; Teng, Shih-Hsin... - p. 178-180 , 2022
Link: https://doi.org/10.1109/..
 
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5

15.4 A 22nm 2Mb ReRAM Compute-in-Memory Macro with 121-28TO..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Xue, Cheng-Xin ; Huang, Tsung-Yuan ; Liu, Je-Syu... - p. 244-246 , 2020
Link: https://doi.org/10.1109/..
 
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6

Content enhanced word art with depth perception:

, In: SIGGRAPH ASIA 2016 Posters,
Yen, Shao-Wei ; Yeh, Chih-Kuo ; Morace, Charles C.... - p. 1-2 , 2016
Link: https://dl.acm.org/doi/1..
 
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7

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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8

Scalable and Bounded-time Decisions on Edge Device Network ..:

, In: 2022 IEEE 28th International Conference on Embedded and Real-Time Computing Systems and Applications (RTCSA),
Shih, Chi-Sheng ; Lin, Hsiang-Jui ; Yuan, Yuyuan.. - p. 170-179 , 2022
Link: https://doi.org/10.1109/..
 
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9

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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10

High Color Conversion Efficiency on Monolayer WSe2 Using Pl..:

, In: 2019 Conference on Lasers and Electro-Optics (CLEO),
Chen, Cheng-Yuan ; Lin, Chen-An ; Lin, Hsiang-Ting... - p. 1-2 , 2019
Link: https://doi.org/10.1364/..
 
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11

Two-Dimensional Positioning and Phase Synchronization Syste..:

, In: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA),
Cheng, Hsiang ; Yang, Sheng-Yeh ; Su, Tzu-Chun... - p. 945-949 , 2023
Link: https://doi.org/10.1109/..
 
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12

3-D Positioning for Drone-Based Spatially Reconfigurable Ph..:

, In: 2023 IEEE Conference on Antenna Measurements and Applications (CAMA),
Su, Tzu-Chun ; Yang, Sheng-Yeh ; Cheng, Hsiang... - p. 888-891 , 2023
Link: https://doi.org/10.1109/..
 
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13

ESD mitigation for 3D IC hybrid bonding:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Lin, Shih-Hsiang ; Simicic, Marko ; Pantano, Nicolas... - p. 1-9 , 2023
Link: https://doi.org/10.23919..
 
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14

Highly stable BiFeO3 RRAM with multilevel storage applicati..:

, In: International Conference on Innovation, Communication and Engineering (ICICE 2023),
Chen, Shih-Hsiang ; Young, Sheng-Joue ; Yang, Chih-Chiang. - p. None , 2023
Link: https://doi.org/10.1049/..
 
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15

Machine Learning-Based Low-Complexity Image Feature Descrip..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Jiang, You-Wei ; Chen, You-Rong ; Lin, Shih-Hsiang. - p. 464-469 , 2023
Link: https://doi.org/10.1109/..
 
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