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Yuan-Chieh Lee
379  Ergebnisse:
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1

CMOS MEMS Resonator for Physical Reservoir Computing:

, In: 2023 IEEE SENSORS,
Chiu, Yi ; Tsai, Fang-Wei ; Wang, Liang-Kai... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Die..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Liang, Ying-Hung ; Chiu, Yuan-Chieh ; Yang, Zusing... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

Common Source Line-to-Word Line Short Improvement by Elimin..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chu, Yuan-Chieh ; Chang, Chih-Chin... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

The thermal stability improvement of spin-orbit-torque (SOT..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chang, Yao-Jen ; Chen, Fang-Ming ; Chen, Kuan-Ming... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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6

Improvement of Twisting and Line-Edge Roughness of 3D NAND ..:

, In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chiu, Yuan-Chieh ; Chang, Yu-Fan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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7

Study of Plasma Ash Rate Enhancement by Machine Learning Mo..:

, In: 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Jheng, Shao-Lou ; Wu, Jyunhong ; Yang, Zusing... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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8

What Does a Network Layer Hear? Analyzing Hidden Representa..:

, In: ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Li, Chung-Yi ; Yuan, Pei-Chieh ; Lee, Hung-Yi - p. 6434-6438 , 2020
Link: https://doi.org/10.1109/..
 
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9

Into the Dynamics of Interpersonal Relationships from Diach..:

, In: 2023 IEEE International Conference on Web Intelligence and Intelligent Agent Technology (WI-IAT),
Lee, Chieh-Yu ; Henriot, Christian ; Hsueh, Hua-Yuan.. - p. 135-141 , 2023
Link: https://doi.org/10.1109/..
 
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10

Real-Time Fall Detection for Embedded System Using Deep Lea..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Yang, Chih-Chieh ; Lee, Chieh-En ; Huang, Tzu-Yuan. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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11

SCμM-V23: Towards A Crystal-Free System-On-Chip For IoT In ..:

, In: 2024 IEEE Workshop on Crystal-Free/-Less Radio and System-Based Research for IoT (CrystalFreeIoT),
Lovell, Daniel ; Yuan, Titan ; Lin, Yu-Chi... - p. 18-23 , 2024
Link: https://doi.org/10.1109/..
 
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12

Obstacle-avoiding free-assignment routing for flip-chip des..:

, In: Proceedings of the 49th Annual Design Automation Conference,
Lee, Po-Wei ; Lee, Hsu-Chieh ; Ho, Yuan-Kai... - p. 1088-1093 , 2012
Link: https://dl.acm.org/doi/1..
 
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13

Escape routing for staggered-pin-array PCBs:

, In: Proceedings of the International Conference on Computer-Aided Design,
Ho, Yuan-Kai ; Lee, Hsu-Chieh ; Chang, Yao-Wen - p. 306-309 , 2011
Link: https://dl.acm.org/doi/1..
 
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14

A digital 3D TCAM accelerator for the inference phase of Ra..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),
Tsai, Chieh-Lin ; Wu, Chun-Feng ; Chang, Yuan-Hao... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
Link: https://doi.org/10.1109/..
 
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