Yue, Wai Mun
45  Ergebnisse:
Personensuche X
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1

Demystifying the Underlying Multi-Faceted Dimensions of AI ..:

, In: 2024 5th International Conference on Intelligent Communication Technologies and Virtual Mobile Networks (ICICV),
 
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2

Do Applications of Artificial Intelligence (AI) Contribute ..:

, In: 2024 10th International Conference on Mechatronics and Robotics Engineering (ICMRE),
Lee, Hui Shan ; Kuang, Kee Seng ; Liew, Ping Xin. - p. 287-292 , 2024
 
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3

Achieving Sustainable Development Goals through Digitalizat..:

, In: 2023 IEEE 11th Conference on Systems, Process & Control (ICSPC),
YAP, Shen ; LEE, Hui Shan ; LIEW, Ping Xin.. - p. 1-6 , 2023
 
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4

Supporting Financial Inclusion with Digital Financial Servi..:

, In: 2023 IEEE International Conference on Artificial Intelligence in Engineering and Technology (IICAIET),
Lee, Hui Shan ; Kuang, Kee Seng ; Liew, Ping Xin.. - p. 283-288 , 2023
 
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5

The impact of ICT in shaping smart urbanization on environm..:

, In: 2022 IEEE 8th International Conference on Smart Instrumentation, Measurement and Applications (ICSIMA),
 
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6

KRF-SLAM: A Robust AI Slam Based On Keypoint Resampling And..:

, In: 2020 IEEE International Conference on Image Processing (ICIP),
Wong, Wai Mun ; Lim, Christopher ; Lee, Chia-Da... - p. 296-299 , 2020
 
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7

Efficiency of General Takaful Industry in Malaysia: A Two-S..:

, In: Proceedings of the Third International Conference on Computing, Mathematics and Statistics (iCMS2017),
Lee, Hui Shan ; Cheng, Fan Fah ; Nassir, Annuar Md.. - p. 529-536 , 2019
 
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8

Impacts of Globalization on Productivity of Insurers in Mal..:

, In: Proceedings of the 2019 3rd International Conference on Software and e-Business,
Lee, Hui Shan ; Cheng, Fan Fah ; Nassir, Annuar Md.. - p. 166-171 , 2019
 
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9

Does Neo-Schumpeterian economics matter? : An analysis o..:

, In: Proceedings of the 2019 2nd International Conference on E-Business, Information Management and Computer Science,
Lee, Hui Shan ; Lee, Sin Yee ; Har, Wai Mun. - p. 1-4 , 2019
 
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10

Serial interface logic built in self test methodology:

, In: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT),
 
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11

Simulation of Wire Bond Clamping and Its effect on Die Pad ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Tan, Lay Tatt ; Tan, Wee Kien ; Wai, Chee Mun - p. 566-569 , 2019
 
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13

List of Contributors:

, In: Hybrid Polymer Composite Materials,
 
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14

ArcGeo: Localizing Limited Field-of-View Images using Cross..:

, In: 2024 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV),
Shugaev, Maxim ; Semenov, Ilya ; Ashley, Kyle... - p. 208-217 , 2024
 
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15

HBRC-500: A Long Range Recognition Benchmark Dataset using ..:

, In: 2023 IEEE International Joint Conference on Biometrics (IJCB),
 
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