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Yun, Seong Jin
288  Ergebnisse:
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1

A fully integrated 2.4/3.4 GHz dual-band CMOS power amplifi..:

, In: 2009 European Microwave Conference (EuMC),
Yoo, Hyun Jin ; Lee, Kang Hyuk ; Oh, Hyuk Jun. - p. None , 2009
Link: https://doi.org/10.23919..
 
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2

A Ceramic Surface Charging Model for Accurate Prediction of..:

, In: 2022 23rd International Vacuum Electronics Conference (IVEC),
Ahn, Yujung ; Park, Sora ; Jeong, Jin-Woo... - p. 470-471 , 2022
Link: https://doi.org/10.1109/..
 
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3

22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lee, Dong Uk ; Cho, Ho Sung ; Kim, Jihwan... - p. 334-336 , 2020
Link: https://doi.org/10.1109/..
 
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4

Microstructural Characterization of Proton-Irradiated 316 S..:

, In: The Minerals, Metals & Materials Series; Proceedings of the 18th International Conference on Environmental Degradation of Materials in Nuclear Power Systems – Water Reactors,
Lim, Yun Soo ; Kim, Dong Jin ; Hwang, Seong Sik - p. 759-772 , 2017
Link: https://doi.org/10.1007/..
 
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5

Direction of arrival estimation with unknown number of sign..:

, In: [Proceedings] Singapore ICCS/ISITA `92,
Jinho Choi ; Iickho Song ; Seong Ill Park. - p. 30,31,32,33,34 , 1992
Link: https://doi.org/10.1109/..
 
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6

Performance characteristics of the fuzzy sign detector:

, In: [Proceedings] Singapore ICCS/ISITA `92,
Sun Yong Kim ; Jae Cheol Son ; Iickho Song.. - p. 380,381,382,383,384 , 1992
Link: https://doi.org/10.1109/..
 
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7

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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8

Sensitivity Analysis for the Lossless Dielectric Material i..:

, In: 2020 IEEE Wireless Power Transfer Conference (WPTC),
Moon, Jung-Ick ; Kim, Sang-Won. ; Kim, Seong-Min.... - p. 391-394 , 2020
Link: https://doi.org/10.1109/..
 
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9

Rescheduling of flexible flow shop with sequence-dependent ..:

, In: Proceedings of the 2017 Winter Simulation Conference,
Kim, Jun ; Lee, Je-Hun ; Choi, Seong-Lak... - p. 1-11 , 2017
Link: https://dl.acm.org/doi/1..
 
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10

A Nanowire Transistor for High Performance Logic and Terabi..:

, In: 2007 IEEE Symposium on VLSI Technology,
Lee, Hyunjin ; Kim, Ju-Hyun ; Bae, Dong-il... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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11

13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Choi, Ikjoon ; Hong, Seunghwan ; Kim, Kihyun... - p. 234-236 , 2024
Link: https://doi.org/10.1109/..
 
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12

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
Link: https://doi.org/10.1109/..
 
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13

Laser-Assisted Bonding with Compression (LABC) based Tiling..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1385-1389 , 2023
Link: https://doi.org/10.1109/..
 
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14

Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 198-203 , 2022
Link: https://doi.org/10.1109/..
 
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15

Development of Digital Signage Modules composed of Mini-LED..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Jang, Ki-seok... - p. 1031-1036 , 2020
Link: https://doi.org/10.1109/..
 
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