Z. Chang
158  Ergebnisse:
Personensuche X
?
1

Anti-collision algorithm of blind source separation for RFI..:

, In: 5th International Conference on Artificial Intelligence and Advanced Manufacturing (AIAM 2023),
Chang, Z. ; Deng, Y. ; Zhao, J.... - p. None , 2023
 
?
2

Effect of Secondary Electron Emission Coefficient of Barrie..:

, In: 2023 IEEE International Conference on Plasma Science (ICOPS),
Fu, Q. ; Ye, Z. ; Wang, Y.. - p. 1-1 , 2023
 
?
3

Research on durability improvement technology of ship power..:

, In: 12th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2022),
Fang, X. ; Chang, Z. ; Wu, S... - p. None , 2022
 
?
4

Reliability analysis of dynamic systems based on SVR-NARX m..:

, In: 12th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2022),
Chang, Z. ; Li, L. ; Liu, Y. - p. None , 2022
 
?
5

Study of a terahertz-band high-order mode orthogonal gratin..:

, In: IET Ph.D Candidates Academic Seminar (China) on Vacuum Electronics (PhASe-VE 2021),
Liao, J. ; Shu, G. ; Ren, J.... - p. None , 2021
 
?
6

A 9-channel low-power receiver ASIC for 3D transesophageal ..:

, In: 2012 IEEE International Ultrasonics Symposium,
Yu, Z. ; Blaak, S. ; Prins, C.... - p. 2063-2066 , 2012
 
?
7

Phase-matched generation of short wavelength, ultrashort-pu..:

, In: Nonlinear Optics '98. Materials, Fundamentals and Applications Topical Meeting (Cat. No.98CH36244),
Durfee, C.G. ; Rundquist, A. ; Backus, S.... - p. 271,272,273 , 1998
 
?
8

A Pitch-Matched Transceiver ASIC for 3D Ultrasonography wit..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Guo, P. ; Chang, Z.Y. ; Noothout, E.... - p. 1-2 , 2023
 
?
9

Active clamp flyback converter combined with dither voltage..:

, In: 2006 37th IEEE Power Electronics Specialists Conference,
Tseng, S.-Y. ; Wu, T.-F. ; Chang, Z.-Y... - p. 1-7 , 2006
 
?
10

A CMOS 155 MHz Clock-Frame Recovery IC for SONET/SDH Applic..:

, In: ESSCIRC '92: Eighteenth European Solid-State Circuits conference,
Chang, Z.Y. ; Delarbre, A. ; Gouwy, C.... - p. 283-286 , 1992
 
?
12

3D Architecture to Integrate Backside Power Interconnect an..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lu, C.-L. ; Lin, S.-C. ; Ho, C.-S.... - p. 1-2 , 2024
 
?
13

4-Layer Wafer on Wafer Stacking Demonstration with Face to ..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Lu, C.-L. ; Chuang, C.-H. ; Huang, C.-H.... - p. 1-2 , 2023
 
?
14

Development of Highly Manufacturable, Reliable, and Energy-..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Rahaman, S. Z. ; Chang, Y.-J. ; Hsin, Y.-C.... - p. 1-2 , 2022
 
?
15

Performance Evaluation of 3D Memory-Logic Hybrid Bond Stack..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chuang, C.-L. ; Lu, C.-L. ; Chen, C.-M.... - p. 1-2 , 2022
 
1-15