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Proceedings of the Great Lakes Symposium on VLSI 2024 ,
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Cost-Effective Value Predictor for ILP processors through D..:
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The Minerals, Metals & Materials Series; TMS 2024 153rd Annual Meeting & Exhibition Supplemental Proceedings ,
2
Temperature Prediction of Continuous Casting Slab Based on ..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
3
Wireless Communication System for Drilling Based on OFDM Us..:
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2023 International Conference on Power System Technology (PowerCon) ,
4
Comparative Analysis of TEV and Pulse Current Method for Pa..:
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Therapeutics of Neural Stimulation for Neurological Disorders ,
5
Depression and Bipolar Affective Disorder:
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Environmental Science and Engineering; Proceedings of 2022 4th International Conference on Environment Sciences and Renewable Energy ,
6
Research on Ecosystem Status Evaluation of Open-Pit Mines:
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2023 IEEE 23rd International Conference on Communication Technology (ICCT) ,
7
Dynamic Beam Hopping for Coverage Enhancement in Multi-Beam..:
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2023 International Symposium on Electrical Insulating Materials (ISEIM) ,
8
Effect of Insulation Thickness on Space Charge Behavior and..:
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2023 IEEE 3rd International Conference on Power, Electronics and Computer Applications (ICPECA) ,
9
Detection of electricity theft based on ISSA-DELM:
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2023 IEEE 4th China International Youth Conference On Electrical Engineering (CIYCEE) ,
10
Study on Partial Discharge of Scratch Defects in Cable Term..:
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2023 9th International Conference on Computer and Communications (ICCC) ,
11
A Multi-Dimensional Joint Anti-Jamming Satellite Communicat..:
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2023 22nd International Symposium on Communications and Information Technologies (ISCIT) ,
12
Integrated Sensing and Communication for UAV-Borne SAR Syst..:
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2023 IEEE/CIC International Conference on Communications in China (ICCC) ,
13
A Low-Complexity PAPR Reduction Scheme for Multi-User MIMO-..:
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ICC 2023 - IEEE International Conference on Communications ,
14
Distributed MMSE Detection with One-Shot Combining for Coop..:
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Proceedings of the Great Lakes Symposium on VLSI 2023 ,
15