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X
Zhang, Pengli
34  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Accurate Assessment of Young's Modulus of Sintered Ag Joint..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Yuning ; Xu, Liang ; Zhu, Pengli.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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2

Rapid Formation of High-Strength Sintered Silver Joints wit..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Zhang, Xu ; Zhu, Pengli ; Zhao, Tao.. - p. 2154-2159 , 2023
Link: https://doi.org/10.1109/..
 
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3

Effect of dimension and defects on the flexibility of ultra..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Pan, Yan ; Zhang, Shuye ; Jin, Taiyu... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

Warpage behavior of the flip chip package in underfill curi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Fan, Yixuan ; Peng, Liang ; Zhang, Zhen'An... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Risk Probability Assessment Method of Distribution Network ..:

, In: 2023 5th International Conference on Power and Energy Technology (ICPET),
Hui, Hui ; Li, Pengli ; Li, Rui... - p. 612-617 , 2023
Link: https://doi.org/10.1109/..
 
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6

In-situ observation of microscale crack-tip strain field ev..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Yu, Xuecheng ; Zhang, Zhenguo ; Li, Gang.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Effect of Chip Size and Shape on the Thermal Stress and Str..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Yuning ; Zhong, Cheng ; Xu, Liang... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

UCB-Based Architecture Search for Remaining Useful Life Pre..:

, In: Lecture Notes in Electrical Engineering; Proceedings of 2023 Chinese Intelligent Systems Conference,
Mao, Pengli ; Lin, Yan ; Zhang, Baochang. - p. 677-686 , 2023
Link: https://doi.org/10.1007/..
 
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9

Effects of Plasma Treatment on Adhesion and Flow Behavior o..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Yang, Yuanyuan ; Fan, Yixuan ; Zhu, Caiping... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

Study on the effects of surface hydroxyl of silica fillers ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Zhenguo ; Yu, Xuecheng ; Zhang, Leicong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

Pressureless and low temperature sintering by Ag paste for ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wang, Chuncheng ; Zhang, Xu ; Zhang, Yudui... - p. 2256-2262 , 2022
Link: https://doi.org/10.1109/..
 
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12

Exploration of Key Factors for the Sintering of Micro-Nano ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Xu ; Zhang, Yudui ; Wang, Chuncheng... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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13

Effect of surface silanol density of silica fillers on the ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Liu ; Du, Xiaomeng ; Qiang, Qianqian... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Strain and Deformation of Flip Chip with Underfill at High ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Zhen'an ; Zhong, Cheng ; Peng, Xu... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

Performance Optimization and Analysis of Combined Cooling, ..:

, In: 2022 IEEE 6th Conference on Energy Internet and Energy System Integration (EI2),
Liu, Yuanhong ; Li, Pengli ; Hui, Hui... - p. 2742-2748 , 2022
Link: https://doi.org/10.1109/..
 
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