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Zhong, Yi
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1

Device-Free Cross-Environment Human Action Recognition Usin..:

, In: Lecture Notes in Electrical Engineering; Artificial Intelligence in China,
Zhang, Sai ; Jiang, Ting ; Ding, Xue.. - p. 141-151 , 2024
Link: https://doi.org/10.1007/..
 
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2

9.3 A 71dB SNDR 200MHz BW Interleaved Pipe-SAR ADC with a S..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
He, Xiyu ; Gu, Mingyang ; Jiang, Hanjun... - p. 172-174 , 2024
Link: https://doi.org/10.1109/..
 
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3

22.4 A 4.8GS/s 7-ENoB Time-Interleaved SAR ADC with Dither-..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Tao, Yunsong ; Gu, Mingyang ; Chi, Baoyong... - p. 394-396 , 2024
Link: https://doi.org/10.1109/..
 
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4

DIPy-AI: Brain-Cognition-Inspired DIKW Pyramid-Based Agile ..:

, In: Biologically Inspired Cognitive Architectures 2023; Studies in Computational Intelligence,
Mishra, Amit Kumar ; Zhong, Yi - p. 604-611 , 2024
Link: https://doi.org/10.1007/..
 
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5

Design of Preamble Structure for UWB-Joint-Communication-an..:

, In: Lecture Notes in Electrical Engineering; Communications, Signal Processing, and Systems,
Qu, Jianxin ; Jiang, Ting ; Jia, Haoge. - p. 27-37 , 2024
Link: https://doi.org/10.1007/..
 
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6

Cognitive Digital Twin Modeling of Robotic Disassembly Proc..:

, In: Lecture Notes in Mechanical Engineering; Advances in Remanufacturing,
Qi, Lei ; Yang, Hang ; Liu, Jiayi.. - p. 133-146 , 2024
Link: https://doi.org/10.1007/..
 
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7

An Unsupervised Domain Adaptation-Based Device-Free Sensing..:

, In: Lecture Notes in Electrical Engineering; Communications, Signal Processing, and Systems,
Zhong, Yi ; Bi, Tianqi ; Wang, Ju.. - p. 167-175 , 2024
Link: https://doi.org/10.1007/..
 
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8

Improved YOLOv5 for Stroller and Luggage Detection:

, In: 2023 4th International Conference on Computer Engineering and Application (ICCEA),
Yang, Jiandang ; Tong, Qinfeng ; Zhong, Yi. - p. 252-257 , 2023
Link: https://doi.org/10.1109/..
 
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9

Signal Deinterleaving Based on U-Net Networks:

, In: 2023 8th International Conference on Computer and Communication Systems (ICCCS),
Kang, Zhi ; Zhong, Yi ; Wu, Yaoyun. - p. 62-67 , 2023
Link: https://doi.org/10.1109/..
 
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10

Fine Pitch Wafer-to-Wafer Hybrid Bonding for Three-Dimensio..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Xiaofan ; Tao, Zeming ; Yu, Tian... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Towards Position-independent Gesture Recognition Based on W..:

, In: 2023 IEEE Wireless Communications and Networking Conference (WCNC),
Yu, Xiao ; Jiang, Ting ; Ding, Xue... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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12

A 12b 1GS/s Pipelined ADC with Digital Background Calibrati..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Gu, Mingyang ; Zhong, Yi ; Jie, Lu. - p. 329-332 , 2023
Link: https://doi.org/10.1109/..
 
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13

An 80.2-to-89.1dB-SNDR 24k-to-200kHz-BW VCO-Based Synthesiz..:

, In: 2023 IEEE Custom Integrated Circuits Conference (CICC),
Zhong, Yi ; Zhan, Mingtao ; Wang, Wei... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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14

Unsupervised Learning of Spike-Timing-Dependent Plasticity ..:

, In: 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
Zhong, Yi ; Wang, Zilin ; Cui, Xiaoxin.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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15

Federated Learning-based Framework for Cross-Environment Hu..:

, In: 2023 IEEE Globecom Workshops (GC Wkshps),
Zhang, Sai ; Jiang, Ting ; Ding, Xue.. - p. 638-643 , 2023
Link: https://doi.org/10.1109/..
 
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