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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Reliability of Indium Solder Joints using a Laser-Assisted ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Micro-structure analysis of solder joint using room tempera..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Process Window of Mini-LED Display Panel Packaging using La..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding with Compression (LABC) based Tiling..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Anisotropic Solder Paste (ASP) Material Solution for Laser ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Mini LED array transferred onto a flexible substrate using ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Interconnection Reliability of Mini LEDs for Display Applic..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Epoxy based Solder Paste for Flexible Substrate with Laser ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Development of bonding process for flexible devices with fi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Development of Digital Signage Modules composed of Mini-LED..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Advanced Interconnection technology with Laser Assisted Bon..:
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2019 International 3D Systems Integration Conference (3DIC) ,
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Development of Laser-Assisted Bonding with Compression (LAB..:
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ,
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