Personensuche
X
?
Proceedings of the ACM 2012 conference on Computer Supported Cooperative Work ,
2
SynTag : a web-based platform for labeling real-time vid..:
, In:
?
Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
3
An Experimental Study on the Displacement Characteristics o..:
, In:
?
2023 IEEE Photonics Conference (IPC) ,
4
Improvement of Thermal Dissipation of High-Power Photodiode:
, In:
?
2023 International Electron Devices Meeting (IEDM) ,
5
Status and Performance of Integration Modules Toward Scaled..:
, In:
?
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
6
Scaled contact length with low contact resistance in monola..:
, In:
?
Lecture Notes in Mechanical Engineering; Proceedings of the 6th China Aeronautical Science and Technology Conference ,
7
A Helicopter Scheduling Model for Flood Aviation Emergency ..:
, In:
?
2023 IEEE/IAS Industrial and Commercial Power System Asia (I&CPS Asia) ,
8
On Cyber-Resilient Microgrid: A Variable Trust Protocol Bas..:
, In:
?
2023 4th International Conference on Mechatronics Technology and Intelligent Manufacturing (ICMTIM) ,
9
Research and Development of Reuse Process and Equipment of ..:
, In:
?
Lecture Notes in Computer Science; Computer Vision – ECCV 2022 ,
10
Automatic Check-Out via Prototype-Based Classifier Learning..:
, In:
?
Proceedings of the Fifteenth ACM International Conference on Web Search and Data Mining ,
11
Bringing Your Own View : Graph Contrastive Learning with..:
, In:
?
2022 IEEE International Conference on Multimedia and Expo (ICME) ,
12
A Channel Mix Method for Fine-Grained Cross-Modal Retrieval:
, In:
?
2022 2nd International Conference on Bioinformatics and Intelligent Computing ,
13
China's farm film utilization efficiency during 2001-2015: ..:
, In:
?
Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering ,
14
Optimization of Multiple Component Thermal Fluid Huff and P..:
, In:
?
2022 IEEE 8th International Conference on Computer and Communications (ICCC) ,
15