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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Cu and barrier CMP process development with fine 1μm Cu bon..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Electrical Characterization and Reliability Studies of Nano..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) ..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Process Development and Integration for Wafer-to-Wafer Hybr..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Optimization of the CMP process for direct wafer-to-wafer o..:
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Proceedings of The 7th ACM SIGGRAPH International Conference on Virtual-Reality Continuum and Its Applications in Industry ,
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Interacting with 3D objects in a virtual environment using ..:
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2020 China Semiconductor Technology International Conference (CSTIC) ,
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Effect of Dissolved Ozone and In-Situ Wafer Cleaning on Pre..:
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2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS) ,
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