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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Cu/Dielectric hybrid bonding among Glass and Si:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Defect evolution during through-silicon via copper electrop..:
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2019 11th International Conference on Knowledge and Systems Engineering (KSE) ,
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Prediction car prices using quantify qualitative data and k..:
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Intelligent Systems and Networks; Lecture Notes in Networks and Systems ,
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