Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Degrenne, N.
6  Ergebnisse:
Artikel (Online) X
Personensuche X
?
1

Analysis of the aging mechanism occurring at the bond-wire ..:

Dornic, N. ; Ibrahim, A. ; Khatir, Z....
Microelectronics Reliability.  114 (2020)  - p. 113873 , 2020
Link: https://doi.org/10.1016/..
 
?
2

Wire-bond contact degradation modeling for remaining useful..:

Nazar, M. ; Ibrahim, A. ; Khatir, Z...
Microelectronics Reliability.  114 (2020)  - p. 113824 , 2020
Link: https://doi.org/10.1016/..
 
?
3

Using of bond-wire resistance as aging indicator of semicon..:

Ibrahim, A. ; Khatir, Z. ; Ousten, J.P....
Microelectronics Reliability.  114 (2020)  - p. 113757 , 2020
Link: https://doi.org/10.1016/..
 
?
4

Lifetime extension through Tj equalisation by use of intell..:

Brandelero, J. ; Ewanchuk, J. ; Degrenne, N..
Microelectronics Reliability.  88-90 (2018)  - p. 428-432 , 2018
Link: https://doi.org/10.1016/..
 
?
5

Lifetime extension through Tj equalisation by use of intell..:

Brandelero, J. ; Ewanchuk, J. ; Degrenne, N..
Microelectronics Reliability.  88-90 (2018)  - p. 428-432 , 2018
Link: https://doi.org/10.1016/..
 
?
6

Bi-directional electrical characterisation of microbial fue..:

Degrenne, N. ; Ledezma, P. ; Bevilacqua, P....
Bioresource Technology.  128 (2013)  - p. 769-773 , 2013
Link: https://doi.org/10.1016/..
 
1-6