He, Songhan
36  Ergebnisse:
Personensuche X
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1

HEVC Video Steganalysis Based on PU Maps and Multi-Scale Co..:

Dai, Haojun ; Wang, Rangding ; Xu, Dawen..
IEEE Transactions on Circuits and Systems for Video Technology.  34 (2024)  4 - p. 2663-2676 , 2024
 
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2

Adaptive HEVC Video Steganography With High Performance Bas..:

He, Songhan ; Xu, Dawen ; Yang, Lin.
IEEE Transactions on Multimedia.  26 (2024)  - p. 687-700 , 2024
 
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3

Centralized Error Distribution-Preserving Adaptive Steganog..:

Yang, Lin ; Wang, Rangding ; Xu, Dawen..
IEEE Transactions on Multimedia.  26 (2024)  - p. 4255-4270 , 2024
 
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4

An anti-steganalysis adaptive steganography for HEVC video ..:

He, Songhan ; Xu, Dawen ; Yang, Lin..
Journal of Visual Communication and Image Representation.  98 (2024)  - p. 103995 , 2024
 
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5

Adaptive HEVC video steganograhpy based on PU partition mod..:

Wang, Shanshan ; Xu, Dawen ; He, Songhan
Journal of Visual Communication and Image Representation.  101 (2024)  - p. 104176 , 2024
 
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6

Adaptive HEVC video steganography based on distortion compe..:

Yang, Lin ; Xu, Dawen ; Wang, Rangding.
Journal of Information Security and Applications.  73 (2023)  - p. 103442 , 2023
 
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7

HEVC video information hiding scheme based on adaptive doub..:

He, Songhan ; Xu, Dawen ; Yang, Lin.
Journal of Visual Communication and Image Representation.  87 (2022)  - p. 103549 , 2022
 
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8

Restriction Analysis of Transport Policy for Bridges Using ..:

Hu, Zhenghua ; Zhou, Jibiao ; Zhang, Shuichao...
Journal of Advanced Transportation.  2020 (2020)  - p. 1-10 , 2020
 
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10

Do State‐Of‐The‐Art Atmospheric CO2 Inverse Models Capture ..:

He, Wei ; Jiang, Fei ; Ju, Weimin...
Journal of Advances in Modeling Earth Systems.  15 (2023)  6 - p. , 2023
 
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12

Modeling China's terrestrial ecosystem gross primary produc..:

Xing, Xiuli ; Wu, Mousong ; Zhang, Wenxin...
Agricultural and Forest Meteorology.  343 (2023)  - p. 109789 , 2023
 
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13

Research of NBR/G@Fe3O4 electromagnetic shielding composite:

Gao, Shengqi ; He, Qin ; Yang, Qingshan..
Journal of Materials Science: Materials in Electronics.  34 (2023)  11 - p. , 2023
 
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