Knickerbocker, John U.
20  Ergebnisse:
Personensuche X
?
2

Development of vacuum underfill technology for a 3D chip st..:

Sakuma, Katsuyuki ; Kohara, Sayuri ; Sueoka, Kuniaki...
Journal of Micromechanics and Microengineering.  21 (2011)  3 - p. 035024 , 2011
 
?
3

More Trivia:

Knickerbocker, John H.
ALA Bulletin.  41 (1947)  6 - p. 191 ff. , 1947
 
?
5

Freedom for All:

Knickerbocker, John H.
ALA Bulletin.  36 (1942)  8 - p. 532 ff. , 1942
 
?
8

Inter Chip Fill for 3D Chip Stack:

Horibe, A. ; Yamada, F. ; Feger, C..
Transactions of The Japan Institute of Electronics Packaging.  2 (2009)  1 - p. 160-162 , 2009
 
?
12

Discovery of Azetidinyl Ketolides for the Treatment of Susc..:

Magee, Thomas V. ; Ripp, Sharon L. ; Li, Bryan...
Journal of Medicinal Chemistry.  52 (2009)  23 - p. 7446-7457 , 2009
 
1-15