E-LIB Suche - Ergebnisse für: de Marneffe, J.-F.

1

Characterization and Advanced Modeling of Dielectric Defect..:

Asanovski, R. ; Arimura, H. ; de Marneffe, J.-F....
IEEE Transactions on Electron Devices. 71 (2024) 3 - p. 1745-1751 , 2024

Link: https://doi.org/10.1109/..

2

Enhancing dielectric passivation on monolayer WS2 via a sac..:

Wyndaele, P.-J. ; de Marneffe, J.-F. ; Sergeant, S....
npj 2D Materials and Applications. 8 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

3

Novel Low Thermal Budget CMOS RMG: Performance and Reliabil..:

Franco, J. ; Arimura, H. ; de Marneffe, J.-F....
IEEE Transactions on Electron Devices. 70 (2023) 12 - p. 6658-6664 , 2023

Link: https://doi.org/10.1109/..

4

Metal barrier induced damage in self-assembly based organos..:

Krishtab, M. ; de Marneffe, J.-F. ; Armini, S....
Applied Surface Science. 485 (2019) - p. 170-178 , 2019

Link: https://doi.org/10.1016/..

5

Area selective grafting of siloxane molecules on low-k diel..:

Rezvanov, A. ; Gornev, E.S. ; de Marneffe, J.-F..
Applied Surface Science. 476 (2019) - p. 317-324 , 2019

Link: https://doi.org/10.1016/..

6

Damage-free plasma etching of porous organo-silicate low-k ..:

Chanson, R. ; Zhang, L. ; Naumov, S....
Scientific Reports. 8 (2018) 1 - p. , 2018

Link: https://doi.org/10.1038/..

7

Plasma induced damage mitigation in spin-on self-assembly b..:

Krishtab, M. ; de Marneffe, J.-F. ; De Gendt, S..
Applied Physics Letters. 110 (2017) 1 - p. , 2017

Link: https://doi.org/10.1063/..

8

Multilayer MoS2 growth by metal and metal oxide sulfurizati..:

Heyne, M. H. ; Chiappe, D. ; Meersschaut, J....
Journal of Materials Chemistry C. 4 (2016) 6 - p. 1295-1304 , 2016

Link: https://doi.org/10.1039/..

9

Influence of porosity on electrical properties of low-k die..:

Choudhury, F. A. ; Nguyen, H. M. ; Baklanov, M. R....
Applied Physics Letters. 109 (2016) 12 - p. , 2016

Link: https://doi.org/10.1063/..

10

Vacuum ultra-violet damage and damage mitigation for plasma..:

de Marneffe, J.-F. ; Zhang, L. ; Heyne, M....
Journal of Applied Physics. 118 (2015) 13 - p. , 2015

Link: https://doi.org/10.1063/..

11

Defect-induced bandgap narrowing in low-k dielectrics:

Guo, X. ; Zheng, H. ; King, S. W....
Applied Physics Letters. 107 (2015) 8 - p. , 2015

Link: https://doi.org/10.1063/..

12

Damage free integration of ultralow-k dielectrics by templa..:

Zhang, L. ; de Marneffe, J.-F. ; Heylen, N....
Applied Physics Letters. 107 (2015) 9 - p. , 2015

Link: https://doi.org/10.1063/..

13

Correlation between stress-induced leakage current and diel..:

Wu, C. ; Li, Y. ; Leśniewska, A....
Journal of Applied Physics. 118 (2015) 16 - p. , 2015

Link: https://doi.org/10.1063/..

14

Publisher's Note: "Defect-induced bandgap narrowing in low-..:

Guo, X. ; Zheng, H. ; King, S. W....
Applied Physics Letters. 107 (2015) 13 - p. , 2015

Link: https://doi.org/10.1063/..

15

Damage Free Cryogenic Etching of a Porous Organosilica Ultr..:

Zhang, L. ; Ljazouli, R. ; Lefaucheux, P....
ECS Solid State Letters. 2 (2012) 2 - p. N5-N7 , 2012

Link: https://doi.org/10.1149/..