E-LIB Suche - Ergebnisse für: Liu, Peisheng

1

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Yan, Lei ; Liu, Peisheng ; Xu, Pengpeng..
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303685/. , 2023

Link: http://www.ncbi.nlm.nih...

2

Mesenchymal stem cells: Emerging concepts and recent advanc..:

Liu, Peisheng ; An, Yongqian ; Zhu, Ting...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10034133/. , 2023

Link: http://www.ncbi.nlm.nih...

3

Effect of Solder Layer Void Damage on the Temperature of IG..:

Xu, Pengpeng ; Liu, Peisheng ; Yan, Lei.
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386478/. , 2023

Link: http://www.ncbi.nlm.nih...

4

Apoptotic vesicles activate autophagy in recipient cells to..:

Li, Zihan ; Wu, Meiling ; Liu, Siying...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9552912/. , 2022

Link: http://www.ncbi.nlm.nih...

5

TXNIP Participated in NLRP3-Mediated Inflammation in a Rat ..:

Liu, Peisheng ; Li, Xiaofeng ; Liu, Jing...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9375583/. , 2022

Link: http://www.ncbi.nlm.nih...

6

TXNIP Participated in NLRP3-Mediated Inflammation in a Rat ..:

Liu, Peisheng ; Li, Xiaofeng ; Liu, Jing...
info:eu-repo/semantics/altIdentifier/doi/10.2147/JIR.S373614. , 2022

Link: https://www.dovepress.co..

7

Rapid and High-Efficiency Laser-Alloying Formation of ZnMgO..:

Liu, Peisheng ; Wang, Hao ; Chen, Jun..
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC4914852/. , 2016

Link: http://www.ncbi.nlm.nih...

8

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Lei Yan ; Peisheng Liu ; Pengpeng Xu..
A:Physics. , 2023

Link: https://doi.org/10.3390/..

9

Mesenchymal stem cells: Emerging concepts and recent advanc..:

Peisheng Liu ; Yongqian An ; Ting Zhu...
https://www.frontiersin.org/articles/10.3389/fcimb.2023.1131218/full. , 2023

Link: https://doi.org/10.3389/..

10

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Lei Yan ; Peisheng Liu ; Pengpeng Xu..
https://www.mdpi.com/2072-666X/14/6/1245. , 2023

Link: https://doi.org/10.3390/..

11

Amyloid-mediated remineralization for tooth hypoplasia of c..:

Xiaohe Guo ; Xiaoxue Yang ; Peisheng Liu...
https://www.frontiersin.org/articles/10.3389/fcimb.2023.1143235/full. , 2023

Link: https://doi.org/10.3389/..

12

Effect of Solder Layer Void Damage on the Temperature of IG..:

Pengpeng Xu ; Peisheng Liu ; Lei Yan.
https://www.mdpi.com/2072-666X/14/7/1344. , 2023

Link: https://doi.org/10.3390/..

13

Effect of Solder Layer Void Damage on the Temperature of IG..:

Pengpeng Xu ; Peisheng Liu ; Lei Yan.
A:Physics. , 2023

Link: https://doi.org/10.3390/..

14

Heat Dissipation Characteristics of IGBT Module Based on Fl..:

Lipeng Tan ; Peisheng Liu ; Chenhui She...
https://www.mdpi.com/2072-666X/13/4/554. , 2022

Link: https://doi.org/10.3390/..

15

Heat Dissipation Characteristics of IGBT Module Based on Fl..:

Lipeng Tan ; Peisheng Liu ; Chenhui She...
https://dx.doi.org/10.3390/mi13040554. , 2022

Link: https://doi.org/10.3390/..