E-LIB Suche - Ergebnisse für: Wu, Fengshun

1

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints:

Tian, Ye ; Ren, Ning ; Zhao, Zhihua..
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6316964/. , 2018

Link: http://www.ncbi.nlm.nih...

2

Wet Etching of Quartz Using a Solution Based on Organic Sol..:

Yang Wan ; Xinghe Luan ; Longzao Zhou.
Smart Materials. , 2022

Link: https://doi.org/10.3390/..

3

Wet Etching of Quartz Using a Solution Based on Organic Sol..:

Yang Wan ; Xinghe Luan ; Longzao Zhou.
https://www.mdpi.com/1996-1944/15/18/6475. , 2022

Link: https://doi.org/10.3390/..

4

BURSTT: Bustling Universe Radio Survey Telescope in Taiwan:

Lin, Hsiu-Hsien ; Lin, Kai-yang ; Li, Chao-Te...
http://arxiv.org/abs/2206.08983. , 2022

Link: http://arxiv.org/abs/220..

5

Effect of remelting heat treatment on the microstructure an..:

Yang Wan ; Longzao Zhou ; Fengshun Wu
https://doi.org/10.1038/s41598-022-13776-z. , 2022

Link: https://doi.org/10.1038/..

6

Microstructural and micromechanical characteristics of tin-..:

Zheng Zhou ; Anna Zhang ; Xu Guan...
2134/13614599.v1. , 2020

Link: https://figshare.com/art..

7

Formation and homogenisation of Sn-Cu interconnects by self..:

Wenbo Zhu ; Xiaoting Wang ; Changqing Liu..
2134/37573. , 2019

Link: https://figshare.com/art..

8

Formation and homogenisation of SnCu interconnects by self..:

Wenbo Zhu ; Xiaoting Wang ; Changqing Liu..
http://www.sciencedirect.com/science/article/pii/S0264127519302187. , 2019

Link: https://doi.org/10.1016/..

9

Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free sol..:

Guang Chen ; Li Liu ; Vadim Silberschmidt...
2134/28340. , 2018

Link: https://figshare.com/art..

10

Ag 3 Sn Compounds Coarsening Behaviors in Micro-Joints:

Ye Tian ; Ning Ren ; Zhihua Zhao..
https://www.mdpi.com/1996-1944/11/12/2509. , 2018

Link: https://doi.org/10.3390/..

11

Microstructural evolution of Cu–Sn–Ni compounds in full int..:

Liping Mo ; Chaowei Guo ; Zheng Zhou..
2134/36624. , 2018

Link: https://figshare.com/art..

12

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints:

Ye Tian ; Ning Ren ; Zhihua Zhao..
Manufacturing Processes and Systems. , 2018

Link: https://doi.org/10.3390/..

13

Diffusion barrier property of electroless Ni-W-P coating in..:

Li Liu ; Zhiwen Chen ; Zhaoxia Zhou...
2134/25511. , 2017

Link: https://figshare.com/art..

14

Thermo-migration behavior of SAC305 lead-free solder reinfo..:

Guang Chen ; Li Liu ; Juan Du...
2134/22918. , 2016

Link: https://figshare.com/art..

15

Retained ratio of reinforcement in SAC305 composite solder ..:

Guang Chen ; Li Liu ; Vadim Silberschmidt...
2134/21916. , 2016

Link: https://figshare.com/art..