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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
4
Effect of Tg and modulus on the underfill reliability in pa..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
7
A Study on Warpage Behavior of Underfill in Flip Chip:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
11
Research on the electrical performance of flexible metal ar..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
Effects of Temperature on the Adhesive Performance of High ..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
15