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Abdul Razak, Nurul Razliana
11  Ergebnisse:
Personensuche X
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1

Microstructural Evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu Comp..:

Somidin, Flora ; Abu Bakar, Muhammad Fakarudin ; Abdul Razak, Nurul Razliana
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012024 , 2022
Link: https://doi.org/10.1088/..
 
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2

Influence of Fly Ash Geopolymer Ceramic Powder Addition on ..:

Somidin, Flora ; Natasha Ilias, Nur Fatin ; Mohamad Zaimi, Nur Syahirah..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012032 , 2022
Link: https://doi.org/10.1088/..
 
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3

Enhancement of Microstructural and Physical Properties of S..:

Mahim, Z. ; Abdul Razak, Nurul Razliana ; Mohd Salleh, Mohd Arif Anuar.
Solid State Phenomena.  280 (2018)  - p. 181-186 , 2018
Link: https://doi.org/10.4028/..
 
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4

Effect of Aluminium Addition on Microstructure and Microhar..:

Abdul Razak, Nurul Razliana ; Adli, Nisrin ; Saud, Norainiza.
Applied Mechanics and Materials.  754-755 (2015)  - p. 166-170 , 2015
Link: https://doi.org/10.4028/..
 
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5

Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Bal..:

Said, Rita Mohd ; Sulwarajan, Kalaiarasi A/P ; Razak, Nurul Razliana Abdul..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012010 , 2022
Link: https://doi.org/10.1088/..
 
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6

Mixed Assembly of Lead-free Solder Joint: A Short Review:

Said, Rita Mohd ; Salleh, Mohd Arif Anuar Mohd ; Ramli, Mohd Izrul Izwan...
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012039 , 2022
Link: https://doi.org/10.1088/..
 
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7

Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with..:

Mahim, Zawawi ; Salleh, Mohd Arif Anuar Mohd ; Saud, Norainiza...
IOP Conference Series: Materials Science and Engineering.  701 (2019)  1 - p. 012030 , 2019
Link: https://doi.org/10.1088/..
 
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8

Interfacial reactions between different Sn-based lead- free..:

Razak, Nurul Razliana Abdul ; Tan, Xin Fu ; McDonald, Stuart D..
IOP Conference Series: Materials Science and Engineering.  701 (2019)  1 - p. 012008 , 2019
Link: https://doi.org/10.1088/..
 
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9

Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on..:

Tan, Xin Fu ; Razak, Nurul Razliana Abdul ; Husain, Muhammad Hafiz..
IOP Conference Series: Materials Science and Engineering.  701 (2019)  1 - p. 012007 , 2019
Link: https://doi.org/10.1088/..
 
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10

Effect of surface finish on the wettability and electrical ..:

Amli, Siti Farahnabilah Muhd ; Salleh, Mohd Arif Anuar Mohd ; Said, Rita. Mohd...
IOP Conference Series: Materials Science and Engineering.  701 (2019)  - p. 012029 , 2019
Link: https://doi.org/10.1088/..
 
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11

Mechanical Properties and Solderability of Robust Sn-0.7Cu ..:

Musa, Sayyidah Amnah ; Saud, Norainiza ; Razak, Nurul Razliana Abdul.
Applied Mechanics and Materials.  754-755 (2015)  - p. 556-560 , 2015
Link: https://doi.org/10.4028/..
 
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