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2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) ,
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Processing and Chracterisation of an Ultra-thin Image Senso..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Hybrid Systems-in-Foil (HySiF) – Low Stress CFP Process for..:
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2016 Progress in Electromagnetic Research Symposium (PIERS) ,
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