Ambat, Rajan
227  Ergebnisse:
Personensuche X
?
2

Study of Interaction Between Reflow Solder Flux and Humidit..:

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Ambat, Rajan
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 510-518 , 2024
 
?
6

Probability of Failure due to Electrochemical Migration on ..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
Bahrebar, Sajjad ; Ambat, Rajan - p. 1-9 , 2023
 
?
9

Effect of flux activator in reflow process related flux res..:

Li, Feng ; Lakkaraju, Anish Rao ; Jellesen, Morten Stendahl.
Journal of Materials Science: Materials in Electronics.  34 (2023)  16 - p. , 2023
 
?
 
1-15