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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Adhesion Copper/Molding Compound: Modeling and Characteriza..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanic..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Copper/Molding Compound Interfacial Delamination:
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