Andena, Luca
83  Ergebnisse:
Personensuche X
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4

Adhesion Copper/Molding Compound: Modeling and Characteriza..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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5

Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanic..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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6

Copper/Molding Compound Interfacial Delamination:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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9

Constitutive models for rubber XII 

proceedings of the 12th European Conference on Constitutive... 
 
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