Ani, Ismail Che
228  Ergebnisse:
Personensuche X
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3

Intermetallic Compound Thickness of Ball Grid Array Solder ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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4

Cardinal and Ordinal Directions Approach in Investigating A..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Ehsan, Abang Annuar...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  9 - p. 1492-1501 , 2022
 
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5

Effects of Underfill Materials on Behavior of Intermetallic..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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6

Discrete Phase Model (DPM) study of nano-reinforced Lead Fr..:

M.Mukhtar, M.A.Fatah ; Abas, Aizat ; Haslinda, M.S...
IOP Conference Series: Materials Science and Engineering.  370 (2018)  - p. 012067 , 2018
 
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7

Reflow Optimization Process: Thermal Stress Using Numerical..:

Ani, F. Che ; Jalar, A. ; Ismail, R....
Arabian Journal for Science and Engineering.  40 (2015)  6 - p. 1669-1679 , 2015
 
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8

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics.  35 (2024)  12 - p. , 2024
 
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10

The influence of Fe2O3 nano-reinforced SAC lead-free solder..:

Che Ani, F. ; Jalar, A. ; Saad, A. A....
The International Journal of Advanced Manufacturing Technology.  96 (2018)  1-4 - p. 717-733 , 2018
 
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11

Backward Compatibility Solder Joint Formation at High Peak ..:

Che Ani, F. ; Jalar, A. ; Ismail, R....
Arabian Journal for Science and Engineering.  41 (2015)  5 - p. 1813-1823 , 2015
 
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