E-LIB Suche - Ergebnisse für: Auersperg, J.

1

Extraction without tooling around — The first comprehensive..:

O'Hara, M. ; Mioduszewska, B. ; Haryoko, T....
Behaviour. 156 (2019) 5-8 - p. 661-690 , 2019

Link: https://doi.org/10.1163/..

2

Extraction without tooling around — The first comprehensive..:

O'Hara, M. ; Mioduszewska, B. ; Haryoko, T....
Behaviour. 156 (2019) 5/8 - p. 661-690 , 2019

Link: https://www.jstor.org/st..

3

No evidence of mirror self-recognition in keas and Goffin's..:

van Buuren, M. ; Auersperg, A. ; Gajdon, G...
Behaviour. 156 (2019) 5/8 - p. 763-786 , 2019

Link: https://www.jstor.org/st..

4

Investigations of the impact of initial stresses on fractur..:

Auersperg, J. ; Auerswald, E. ; Collet, C....
Microelectronics Reliability. 87 (2018) - p. 238-244 , 2018

Link: https://doi.org/10.1016/..

5

Effects of residual stresses on cracking and delamination r..:

Auersperg, J. ; Collet, C. ; Dean, Th...
Microelectronics Reliability. 64 (2016) - p. 665-668 , 2016

Link: https://doi.org/10.1016/..

6

On the crack and delamination risk optimization of a Si-int..:

Auersperg, J. ; Dudek, R. ; Jordan, R....
Microelectronics Reliability. 54 (2014) 6-7 - p. 1223-1227 , 2014

Link: https://doi.org/10.1016/..

7

Stress analyses of high spatial resolution on TSV and BEoL ..:

Vogel, D. ; Auerswald, E. ; Auersperg, J....
Microelectronics Reliability. 54 (2014) 9-10 - p. 1963-1968 , 2014

Link: https://doi.org/10.1016/..

8

Characterisation of Strength Behaviour of Aluminium Foam Sa..:

Vogel, J. ; Keller, J. ; Sviridov, A....
Strain. 47 (2011) s1 - p. , 2011

Link: https://doi.org/10.1111/..

9

Application of interfacial fracture mechanics approach for ..:

Dreßler, M. ; Becker, K-F. ; Wunderle, B...
Microsystem Technologies. 15 (2008) 1 - p. 83-88 , 2008

Link: https://doi.org/10.1007/..

10

Identifying the Reliability Affecting Parameters of SBB Fli..:

, In: 2006 1st Electronic Systemintegration Technology Conference,

Dressler, M. ; Rohde, H. ; Liebing, G.... - p. None , 2006

Link: https://doi.org/10.1109/..

11

FibDAC - Residual Stress Determination by Combination of Fo..:

Keller, J. ; Gollhardt, A. ; Vogel, Dietmar...
Materials Science Forum. 524-525 (2006) - p. 121-126 , 2006

Link: https://doi.org/10.4028/..

12

Verbundprojekt: Informations- und Kommunikationsplattform R..

Laufzeit: 01.11.2002 - 31.10.2004 ; Schlussbericht

Keller, Jürgen ; Auersperg, J. , [ca. 2004]

Link: http://edok01.tib.uni-ha..

13

Integration modular aufgebauter Antriebssysteme in Maschine..

Abschlussbericht zum BMBF-Verbundprojekt ; Laufzeit des Vor...

Auersperg, J. ; Kaulfersch, E. ; Kreyßig, K. , 2004

Link: http://edok01.tib.uni-ha..

14

Modular parametric finite element modelling for reliability..:

Wunderle, B. ; Auersperg, J. ; Großer, V....
Microsystem Technologies. 10 (2004) 5 - p. 375-381 , 2004

Link: https://doi.org/10.1007/..

15

Die periphere Beeinflußbarkeit postcommotioneller Kopfschme..:

Auersperg
Deutsche Zeitschrift für Nervenheilkunde. 155 (1943) 3-4 - p. 153-166 , 1943

Link: https://doi.org/10.1007/..