Avenas, Yvan
218  Ergebnisse:
Personensuche X
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2

Flip-Chip Low inductive and EMC optimized PCB Power Module:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
 
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3

Impact of the Printed Circuit Board Geometrical Design on t..:

, In: 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP),
 
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4

Design of Power Modules Using Containers Filled With Phase ..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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5

Effect of Large Amplitude Thermal Cycles on Power Assemblie..:

Botter, Nicolas ; Khazaka, Rabih ; Avenas, Yvan...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 211-218 , 2023
 
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6

Power Module Using Ceramic Heat Sink and Multilayers Silver..:

Botter, Nicolas ; Khazaka, Rabih ; Avenas, Yvan..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  7 - p. 1082-1090 , 2022
 
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9

Design by Optimization of multiphase inverter for electric ..:

, In: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe),
 
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10

Implementation of TAPIR Switching Cells with Integrated Dir..:

, In: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe),
 
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11

Online capacitor early ageing monitoring and detection usin..:

Qaedi, Ramin ; Farjah, Ebrahim ; Ghanbari, Teymoor.
IET Science, Measurement & Technology.  14 (2020)  9 - p. 731-738 , 2020
 
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12

Teaching how to characterize and implement high speed power..:

, In: 2019 IEEE Energy Conversion Congress and Exposition (ECCE),
Schanen, Jean-Luc ; Hanna, R. ; Chazal, H.... - p. 404-411 , 2019
 
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13

An Analytical Model for the Optimisation of Metal Foam for ..:

, In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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