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2024 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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Flip-Chip Low inductive and EMC optimized PCB Power Module:
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2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) ,
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Impact of the Printed Circuit Board Geometrical Design on t..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Design of Power Modules Using Containers Filled With Phase ..:
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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) ,
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Design by Optimization of multiphase inverter for electric ..:
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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) ,
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Implementation of TAPIR Switching Cells with Integrated Dir..:
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2019 IEEE Energy Conversion Congress and Exposition (ECCE) ,
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Teaching how to characterize and implement high speed power..:
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2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
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