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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
1
A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:
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Proceedings of the 2007 spring simulation multiconference - Volume 3 ,
3
A case study of 3D simulation for developing automatic asse..:
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Proceedings of the 2007 spring simulation multiconference - Volume 3 ,
4