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Bakir, Amal S
393  Ergebnisse:
Personensuche X
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1

Vitronectin (VTN): A Novel Diagnostic and Prognostic Marker..:

Bakir, Amal S ; Al-Kilany, Hesham H ; Ghait, Ramy S.
QJM: An International Journal of Medicine.  114 (2021)  Supplement_1 - p. , 2021
Link: https://doi.org/10.1093/..
 
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2

Serum TGF-β, Serum MMP-1, and HOMA-IR as non-invasive predi..:

Adel A Mahmoud ; Amal S Bakir ; Sherif S Shabana
http://www.saudijgastro.com/article.asp?issn=1319-3767;year=2012;volume=18;issue=5;spage=327;epage=333;aulast=Mahmoud.  , 2012
Link: https://doi.org/10.4103/..
 
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3

Electrical Demonstration of an RF Embedded Multi-Chip Modul..:

Zheng, Ting ; Bakir, Muhannad S.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
Link: https://doi.org/10.1109/..
 
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4

Characterization of Warpage of Ultra-Low-K Dielectric Mater..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kathaperumal, Mohanalingam ; Bhaskar, Pragna ; Toro, Austin J.... - p. 1958-1962 , 2024
Link: https://doi.org/10.1109/..
 
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5

Electrical Characterization of Shielded TSVs With Airgap Is..:

Oh, Shane ; Zheng, Ting ; Bakir, Muhannad S.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  2 - p. 202-210 , 2024
Link: https://doi.org/10.1109/..
 
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6

Multi-Chiplet Implementation of a Replaceable Integrated Ch..:

Nieves Calderon, Michael A. ; Oh, Shane ; Brescia, Jonathan R..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 529-532 , 2024
Link: https://doi.org/10.1109/..
 
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7

Performance Evaluation of UCIe-based Die-to-Die Interface o..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Penta, Srujan ; Zheng, Ting ; Tremble, Eric... - p. 274-278 , 2024
Link: https://doi.org/10.1109/..
 
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8

Electrical-Thermal Co-analysis of TSV Embedded Microfluidic..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chung, Euichul ; Yan, Geyu ; Ramakrishnan, Bharath... - p. 1479-1484 , 2024
Link: https://doi.org/10.1109/..
 
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9

Design Space Exploration for Power Delivery Network in Next..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Manley, Madison ; Kaul, Ankit ; Bakir, Muhannad S. - p. 2223-2228 , 2024
Link: https://doi.org/10.1109/..
 
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10

Reconstituted-SiO2 Tier with Integrated Copper Heat Spreade:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Victor, Ashita ; Manley, Madison ; Oh, Shane. - p. 1767-1772 , 2023
Link: https://doi.org/10.1109/..
 
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11

Design Considerations for Power Delivery Network and Metal-..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kaul, Ankit ; Hossen, Md Obaidul ; Manley, Madison. - p. 985-990 , 2023
Link: https://doi.org/10.1109/..
 
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12

3-D Heterogeneous Integration of RRAM-Based Compute-In-Memo..:

Kaul, Ankit ; Luo, Yandong ; Peng, Xiaochen...
IEEE Transactions on Electron Devices.  70 (2023)  2 - p. 485-492 , 2023
Link: https://doi.org/10.1109/..
 
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13

H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Di..:

Li, Wantong ; Manley, Madison ; Read, James...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  31 (2023)  10 - p. 1592-1602 , 2023
Link: https://doi.org/10.1109/..
 
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14

Scalable Fiber-Array-to-Chip Interconnections with Sub-Micr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yu, Shengtao ; Gaylord, Thomas K. ; Bakir, Muhannad S. - p. 748-752 , 2023
Link: https://doi.org/10.1109/..
 
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15

Benchmarking and Demonstration of Low-Loss Fused-Silica Sti..:

Zheng, Ting ; Bakir, Muhannad S.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  7 - p. 1064-1066 , 2023
Link: https://doi.org/10.1109/..
 
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