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Bang, Junghwan
95  Ergebnisse:
Personensuche X
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1

Long-Term Reliability of Sintering Paste Using Ag Coated Cu..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kim, Dajung ; Won, Mi so ; Yang, Hyunseung.. - p. 325-326 , 2024
Link: https://doi.org/10.23919..
 
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2

Improving mechanical stability of Al/Cu ultrasonic bonded j..:

Jeong, Jong-Min ; Kim, Dongjin ; Kim, Jungsoo...
Journal of Materials Science: Materials in Electronics.  35 (2024)  4 - p. , 2024
Link: https://doi.org/10.1007/..
 
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3

Low-iridium doped single-crystalline hydrogenated titanates..:

Jung, Sun Young ; Kim, Kang Min ; Ryu, Jeong Ho...
Journal of Alloys and Compounds.  946 (2023)  - p. 169466 , 2023
Link: https://doi.org/10.1016/..
 
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4

Thermal reliability of Cu sintering joints for high-tempera..:

Son, Junhyuk ; Yu, Dong-Yurl ; Kim, Yun-Chan...
Microelectronics Reliability.  147 (2023)  - p. 115002 , 2023
Link: https://doi.org/10.1016/..
 
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5

Zn-doped nickel iron (oxy)hydroxide nanocubes passivated by..:

Jung Kim, So ; Choi, Heechae ; Ho Ryu, Jeong...
Journal of Energy Chemistry.  81 (2023)  - p. 82-92 , 2023
Link: https://doi.org/10.1016/..
 
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6

Highly increased hydrovoltaic power generation via surfacta..:

Youm, Jiyoon ; Lee, Seung-Hwan ; Cho, Inhee...
Surfaces and Interfaces.  38 (2023)  - p. 102853 , 2023
Link: https://doi.org/10.1016/..
 
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7

Mechanical properties of TiC reinforced MgO–ZrO2 composites..:

Lee, Junho ; Jang, Kyu-bong ; Lee, Seokhyun...
Ceramics International.  49 (2023)  11 - p. 17255-17260 , 2023
Link: https://doi.org/10.1016/..
 
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8

Fast, facile and thermal damage free nanowelding of Ag nano..:

Jeong, Jong-Min ; Sohn, Minjeong ; Bang, Junghwan..
Scientific Reports.  13 (2023)  1 - p. , 2023
Link: https://doi.org/10.1038/..
 
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9

Effects of solvents, activators, and additives on sintering..:

Son, Junhyuk ; Yu, Dong-Yurl ; Kim, Yun-Chan...
Journal of Materials Science: Materials in Electronics.  34 (2023)  19 - p. , 2023
Link: https://doi.org/10.1007/..
 
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10

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Ele..:

Jun, So-Yeon ; Bang, Jung-Hwan ; Kim, Min-Su...
Materials.  16 (2023)  4 - p. 1739 , 2023
Link: https://doi.org/10.3390/..
 
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11

Amorphous‐Crystalline Interfaces on Hollow Nanocubes Derive..:

Han, HyukSu ; Kim, So Jung ; Jung, Sun Young...
Small.  19 (2023)  49 - p. , 2023
Link: https://doi.org/10.1002/..
 
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12

Amorphous‐Crystalline Interfaces on Hollow Nanocubes Derive..:

Han, HyukSu ; Kim, So Jung ; Jung, Sun Young...
Small.  19 (2023)  49 - p. , 2023
Link: https://doi.org/10.1002/..
 
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13

Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assis..:

Kim, Shin-Il ; Yu, Dong-Yurl ; Kim, Yun-Chan...
Journal of Welding and Joining.  41 (2023)  4 - p. 291-298 , 2023
Link: https://doi.org/10.5781/..
 
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14

Corrigendum to: "Low-iridium doped single-crystalline hydro..:

Jung, Sun Young ; Kim, Kang Min ; Ryu, Jeong Ho...
Journal of Alloys and Compounds.  947 (2023)  - p. 169627 , 2023
Link: https://doi.org/10.1016/..
 
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15

Effect of Bimodal Cu Paste on Interfacial Properties and Me..:

Son, Junhyuk ; Yu, Dong-Yurl ; Kim, Yun-Chan..
Journal of Electronic Materials.  51 (2022)  12 - p. 7326-7336 , 2022
Link: https://doi.org/10.1007/..
 
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