Baosheng Liu
1367  Ergebnisse:
Personensuche X
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1

Hot Deformation Behavior and Softening Mechanism of As-Cast..:

Min, Wu ; Baosheng, Liu ; Shoulu, Zhang...
Journal of Materials Engineering and Performance.  29 (2020)  2 - p. 727-738 , 2020
 
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2

A non-incremental time-space algorithm for numerical simula..:

Baosheng, Liu ; Dapeng, Chen ; Yu, Liu
Applied Mathematics and Mechanics.  17 (1996)  11 - p. 1021-1029 , 1996
 
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3

Reduced erosion and its erosion reducing mechanism of gun p..:

Liang, Taixin ; Lu, Jiaxin ; Xiao, Fei...
Journal of Materials Science & Technology.  207 (2025)  - p. 86-94 , 2025
 
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4

Investigation of microstructure characteristics, kinetics, ..:

Chen, Yiwan ; Yong, Hui ; Wang, Shuai...
International Journal of Hydrogen Energy.  69 (2024)  - p. 1329-1340 , 2024
 
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5

Artificial aging behavior of SiCP/AA2009 composite by elect..:

Wang, Zhenxiao ; Dong, Hongrui ; Zhou, Wenbin...
Materials Science and Engineering: A.  910 (2024)  - p. 146889 , 2024
 
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6

New insights on the effect of chloride concentrations and M..:

Zhang, Shaohua ; Bian, Tiantian ; Yu, Hui...
Materials Today Communications.  40 (2024)  - p. 109448 , 2024
 
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8

Porous and graphitic carbon nanosheets with controllable st..:

Zhang, Xiaohua ; Jiang, Chao ; Zhao, Jixin...
Journal of Colloid and Interface Science.  664 (2024)  - p. 146-155 , 2024
 
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10

Liquid-waste derived magnetic porous carbon sphere for effe..:

Zhang, Xiaohua ; Han, Ruyun ; Gao, Xinli...
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  687 (2024)  - p. 133522 , 2024
 
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12

Anticorrosion and discharge performance of calcium and neod..:

Liu, Baosheng ; Gao, Ang ; Zhang, Zhechao...
Journal of Materials Science & Technology.  193 (2024)  - p. 132-145 , 2024
 
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14

Study on catalytic mechanism of Yb2O3 on RE-Mg based hydrog..:

Yong, Hui ; Yu, Shuo ; Wang, Xiangyang...
Journal of Alloys and Compounds.  971 (2024)  - p. 172777 , 2024
 
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15

Electronic structure and delithiation mechanism of vanadium..:

Chen, Rui ; Luo, Jiaolian ; Yang, Anqi...
Journal of Materials Science: Materials in Electronics.  35 (2024)  19 - p. , 2024
 
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