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Becker, Karl-Friedrich
2303  Ergebnisse:
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1

Inter-patient heterogeneity in the hepatic ischemia-reperfu..:

Groiss, Silvia ; Viertler, Christian ; Kap, Marcel...
New Biotechnology.  79 (2024)  - p. 20-29 , 2024
Link: https://doi.org/10.1016/..
 
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2

How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Adler, Marius... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

Key Technologies and Design Aspects for Wafer Level Packagi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Zoschke, Kai ; Oppermann, Hermann ; Schiffer, Michael... - p. 433-440 , 2024
Link: https://doi.org/10.1109/..
 
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4

3D Freeform Antenna-in-Package Approach for FOWLP:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Thomas, Tina ; Becker, Karl-Friedrich... - p. 247-252 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Closer Look to Fan-out Panel Level Packaging:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Braun, Tanja ; Holck, Ole ; Voitel, Marcus... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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6

Thermal Test Vehicle for HPC – System Level Approach for In..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Sternberg, Maik ; May, Daniel ; Pareek, Kaushal Arun... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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7

Panel Level Packaging – Where are the Technology Limits?:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Obst, Mattis... - p. 807-818 , 2022
Link: https://doi.org/10.1109/..
 
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8

Packaging Platform for low to medium Power Packages:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Thomas, Tina ; Nguyen, Thanh Duy ; Blechert, Martin... - p. 39-44 , 2022
Link: https://doi.org/10.1109/..
 
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9

Miniaturized Sensor Modules for under Water Applications re..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Schutze, David ; Voitel, Marcus ; Gottwald, Stefan... - p. 49-54 , 2022
Link: https://doi.org/10.1109/..
 
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10

Histological evaluation of PAXgene tissue fixation in Barre..:

Barroux, Melissa ; Horstmann, Julia ; Fricke, Lisa...
Virchows Archiv.  482 (2022)  5 - p. 887-898 , 2022
Link: https://doi.org/10.1007/..
 
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11

Fan-Out Wafer and Panel Level Packaging - A Platform for 3D..:

, In: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Braun, Tania ; Becker, Karl-Friedrich ; Topper, Michael.. - p. 1-3 , 2021
Link: https://doi.org/10.1109/..
 
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12

Stakeholder engagement to ensure the sustainability of biob..:

Klingler, Corinna ; von Jagwitz-Biegnitz, Magdaléna ; Baber, Ronny...
European Journal of Human Genetics.  30 (2021)  12 - p. 1344-1354 , 2021
Link: https://doi.org/10.1038/..
 
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13

Assessment of kallikrein-related peptidases 4, 5, 7 and 12 ..:

Gong, Weiwei , 2020
Link: http://nbn-resolving.de/..
 
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14

Identification of Molecular Components Regulating the PI3K ..:

Chalaud, Géraldine Ingrid , 2020
Link: http://nbn-resolving.de/..
 
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15

Fan-out Wafer Level Packaging of GaN Components for RF Appl..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Nguyen, Thanh Duy ; Voges, Steve... - p. 7-13 , 2020
Link: https://doi.org/10.1109/..
 
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