E-LIB Suche - Ergebnisse für: Beichao, Zhang

1

Investigation of bump defects formed in back end of line fo..:

Zhou, Ming ; Hao, Deng ; Beichao, Zhang
Surface and Interface Analysis. 48 (2016) 10 - p. 1072-1079 , 2016

Link: https://doi.org/10.1002/..

2

Investigation of defect formation in porous ultra low k fil..:

Ming, Zhou ; Hao, Deng ; Beichao, Zhang
Microelectronic Engineering. 140 (2015) - p. 6-10 , 2015

Link: https://doi.org/10.1016/..

3

Preparation of porous ultra low k films using different sac..:

Ming, Zhou ; Beichao, Zhang
Materials Science in Semiconductor Processing. 36 (2015) - p. 170-178 , 2015

Link: https://doi.org/10.1016/..

4

The effects of UV radiation with single and dual wavelength..:

Ming, Zhou ; Deng, Hao ; Yi Xie, Shu.
Materials Science in Semiconductor Processing. 39 (2015) - p. 235-242 , 2015

Link: https://doi.org/10.1016/..

5

The Influence of Top Metal (TM) Layer Stress on Underneath ..:

Wang, Zong tao ; Zhou, Ming ; Zhang, Beichao
ECS Transactions. 60 (2014) 1 - p. 39-44 , 2014

Link: https://doi.org/10.1149/..

6

Siconi Process Applications Study for 28nm Technology Node ..:

Tong, Hao ; Zhang, Bin ; Deng, Hao...
ECS Transactions. 60 (2014) 1 - p. 447-451 , 2014

Link: https://doi.org/10.1149/..

7

Flowable CVD Process Application for Gap Fill at Advanced T..:

Yan, Yan ; Zhang, Bin ; Deng, Hao...
ECS Transactions. 60 (2014) 1 - p. 503-506 , 2014

Link: https://doi.org/10.1149/..

8

K Repair and RC Improvement in 28nm Logic Devices and Beyon:

Zhou, Ming ; Chai, Qinglin ; Chen, Yingjie...
ECS Transactions. 60 (2014) 1 - p. 459-461 , 2014

Link: https://doi.org/10.1149/..

9

PVD TiN for Bottom Electrode of Phase Change Memory:

Ren, Wanchun ; Liu, Bo ; Xu, Zhen...
ECS Transactions. 60 (2014) 1 - p. 533-538 , 2014

Link: https://doi.org/10.1149/..

10

Investigating and Solving Popcorn Defect Produced from Low ..:

Zhou, Ming ; Zhang, Beichao
ECS Transactions. 60 (2014) 1 - p. 437-445 , 2014

Link: https://doi.org/10.1149/..

11

Process Optimization of Dielectric CVD Film for Patterning ..:

Deng, Hao ; Zhang, Bin ; Xiang, Yang Hui...
ECS Transactions. 52 (2013) 1 - p. 409-413 , 2013

Link: https://doi.org/10.1149/..

12

A High-Quality Spacer Oxide Formation for 28nm Technology N..:

Zhang, Bin ; Xiang, Yang Hui ; Deng, Hao..
ECS Transactions. 44 (2012) 1 - p. 407-410 , 2012

Link: https://doi.org/10.1149/..

13

The Contributions of Barrier Resputter for BEOL Integration:

He, Weiye ; Zhang, Beichao ; Kang, Jian...
ECS Transactions. 44 (2012) 1 - p. 487-492 , 2012

Link: https://doi.org/10.1149/..

14

Thin Film Challenges in 28nm Technology Node:

Zhang, Beichao ; Zhang, Bin ; Xiao, Haibo...
ECS Transactions. 44 (2012) 1 - p. 391-394 , 2012

Link: https://doi.org/10.1149/..

15

A Study of SiCN Cap Process Resultant Plasma Induced Damage..:

Zhou, Ming ; Xiang, Yang Hui ; Guo, Shi Bi...
ECS Transactions. 44 (2012) 1 - p. 423-429 , 2012

Link: https://doi.org/10.1149/..