Bernson, Robert
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Reference Thermal Chips for 2D and 3D Co-packaging Process ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Gupta, Parnika ; Bernson, Robert ; Nudds, Noreen... - p. 2160-2165 , 2023
 
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Packaging strategies for 3D integration of Photonic and Ele..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Bernson, Robert ; Wakeel, Saif ; Gupta, Parnika... - p. 804-808 , 2023
 
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