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X
Bertheau, J.
1586  Ergebnisse:
Personensuche X
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1

Microtexture effects on fatigue and dwell-fatigue lifetimes..:

Hémery, S. ; Bertheau, D. ; Hamon, F.
International Journal of Fatigue.  179 (2024)  - p. 108068 , 2024
Link: https://doi.org/10.1016/..
 
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2

Paramètres spatio-temporels de la stabilité posturale et de..:

Nephtali, J.L. ; Bertheau, J. ; Nguyen, C....
Revue du Rhumatisme.  90 (2023)  - p. A296 , 2023
Link: https://doi.org/10.1016/..
 
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3

Tensile properties of Ti-6Al-4V as-built by laser metal dep..:

Yvinec, T. ; Naït-Ali, A. ; Mellier, D....
Additive Manufacturing.  55 (2022)  - p. 102830 , 2022
Link: https://doi.org/10.1016/..
 
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4

Evaluation of type-B RR dimerization in poplar: A mechanism..:

Djeghdir, I. ; Chefdor, F. ; Bertheau, L....
Plant Science.  313 (2021)  - p. 111068 , 2021
Link: https://doi.org/10.1016/..
 
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5

Novell embedded microbump approach for die-to-die and wafer..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Derakhshandeh, J. ; Beyne, E. ; Capuz, G.... - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
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6

TSV-assisted hybrid FinFET CMOS — Silicon Photonics Technol..:

, In: 45th European Conference on Optical Communication (ECOC 2019),
Guermandi, D. ; Bogaerts, L. ; Rakowski, M.... - p. 1-4 , 2019
Link: https://doi.org/10.1049/..
 
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7

Highlighting type A RRs as potential regulators of the dkHK..:

Chefdor, F. ; Héricourt, F. ; Koudounas, K....
Plant Science.  277 (2018)  - p. 68-78 , 2018
Link: https://doi.org/10.1016/..
 
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8

Anisotropy in creep properties of DS200 + Hf alloy:

Mataveli Suave, L. ; Cormier, J. ; Villechaise, P....
Materials at High Temperatures.  33 (2016)  4-5 - p. 361-371 , 2016
Link: https://doi.org/10.1080/..
 
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9

Influence of the Porous Microstructure on the Elastic Prope..:

Milhet, X. ; Gadaud, P. ; Caccuri, V....
Journal of Electronic Materials.  44 (2015)  10 - p. 3948-3956 , 2015
Link: https://doi.org/10.1007/..
 
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10

Reflow processes in micro-bumps studied by synchrotron X-ra..:

Bertheau, J. ; Bleuet, P. ; Hodaj, F....
Microelectronic Engineering.  113 (2014)  - p. 123-129 , 2014
Link: https://doi.org/10.1016/..
 
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11

Mechanical Properties of Sintered Ag as a New Material for ..:

Caccuri, V. ; Milhet, X. ; Gadaud, P...
Journal of Electronic Materials.  43 (2014)  12 - p. 4510-4514 , 2014
Link: https://doi.org/10.1007/..
 
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12

Deep sub micrometer imaging of defects in copper pillars by..:

Laloum, D. ; Lorut, F. ; Bertheau, J...
Micron.  58 (2014)  - p. 1-8 , 2014
Link: https://doi.org/10.1016/..
 
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13

Specifications for Hard Condensed Matter Specimens for Thre..:

Bleuet, P. ; Audoit, G. ; Barnes, J.-P....
Microscopy and Microanalysis.  19 (2013)  3 - p. 726-739 , 2013
Link: https://doi.org/10.1017/..
 
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14

Three-dimensional imaging of copper pillars using x-ray tom..:

Martin, N. ; Bertheau, J. ; Bleuet, P....
Review of Scientific Instruments.  84 (2013)  2 - p. 023708 , 2013
Link: https://doi.org/10.1063/..
 
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15

In plantavalidation of HK1 homodimerization and recruitment..:

Bertheau, L. ; Miranda, M. ; Foureau, E....
Plant Biosystems - An International Journal Dealing with all Aspects of Plant Biology.  147 (2013)  4 - p. 991-995 , 2013
Link: https://doi.org/10.1080/..
 
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