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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Reliability Investigations of Polymer Based Redistribution ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:
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2019 International 3D Systems Integration Conference (3DIC) ,
3
Protective Layer for Collective Die to Wafer Hybrid Bonding:
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2019 International Wafer Level Packaging Conference (IWLPC) ,
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Novel Temporary Bonding and Debonding Solutions Enabling an..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
7