Bertheau, Julien
85  Ergebnisse:
Personensuche X
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1

Reliability Investigations of Polymer Based Redistribution ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kwak, Ji-Youn ; Chery, Emmanuel ; Bertheau, Julien... - p. 1080-1084 , 2023
 
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2

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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3

Protective Layer for Collective Die to Wafer Hybrid Bonding:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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4

Novel Temporary Bonding and Debonding Solutions Enabling an..:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),
Podpod, Arnita ; Miller, Andy ; Beyer, Gerald... - p. 1-6 , 2019
 
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7

Development of compression molding process for Fan-Out wafe..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
1-15
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